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1. (WO2019027207) METHOD FOR MANUFACTURING POLYIMIDE FILM USING FUMED SILICA PARTICLES AND POLYIMIDE FILM HAVING LOW DIELECTRIC CONSTANT
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Pub. No.: WO/2019/027207 International Application No.: PCT/KR2018/008624
Publication Date: 07.02.2019 International Filing Date: 30.07.2018
IPC:
C08J 5/18 (2006.01) ,C08K 3/36 (2006.01) ,C08G 73/10 (2006.01) ,C08K 7/26 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
22
Expanded, porous or hollow particles
24
inorganic
26
Silicon-containing compounds
Applicants:
에스케이씨코오롱피아이 주식회사 SKCKOLON PI INC. [KR/KR]; 충청북도 진천군 이월면 고등1길 27 27, Godeung 1-gil, Iwol-myeon, Jincheon-gun, Chungcheongbuk-do 27818, KR
Inventors:
백승열 BACK, Sungyul; KR
이길남 LEE, Kil-Nam; KR
임현재 LIM, Hyun Jai; KR
Agent:
제일특허법인(유) FIRSTLAW P.C.; 서울시 서초구 마방로 60 60 Mabang-Ro, Seocho-Ku, Seoul 06775, KR
Priority Data:
10-2017-009824102.08.2017KR
Title (EN) METHOD FOR MANUFACTURING POLYIMIDE FILM USING FUMED SILICA PARTICLES AND POLYIMIDE FILM HAVING LOW DIELECTRIC CONSTANT
(FR) PROCÉDÉ DE FABRICATION D'UN FILM DE POLYIMIDE À L'AIDE DE PARTICULES DE SILICE FUMÉE ET FILM DE POLYIMIDE AYANT UNE FAIBLE CONSTANTE DIÉLECTRIQUE
(KO) 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
Abstract:
(EN) The present invention relates to a method for manufacturing a polyimide film using fumed silica particles, and a polyimide film having a low dielecgric constant manufactured by the method. The polyimide film manufactured by the method according to the present invention has a minimal dielectric constant and thus can ben useful in an insulator, a buffer material, and a circuit board among others, inside of electric devices and the like.
(FR) La présente invention concerne un procédé de fabrication d'un film de polyimide à l'aide de particules de silice fumée, et un film de polyimide ayant une faible constante diélectrique fabriquée par le procédé. Le film de polyimide fabriqué par le procédé selon la présente invention présente une constante diélectrique minimale et peut donc être utile dans un isolant, un matériau tampon, et une carte de circuit imprimé entre autres, à l'intérieur de dispositifs électriques et équivalents.
(KO) 본 발명은 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법, 및 상기 방법에 따라 제조된 저유전율의 폴리이미드 필름에 관한 것으로, 본 발명의 방법에 따라 제조된 폴리이미드 필름은 유전율이 최소화되어, 전기기기 등의 내부 절연체, 완충재, 회로기판 등에 유용하게 사용될 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)