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1. (WO2019027174) ANTI-CREASING COPPER FOIL, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
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Pub. No.: WO/2019/027174 International Application No.: PCT/KR2018/008399
Publication Date: 07.02.2019 International Filing Date: 25.07.2018
IPC:
C25D 1/04 (2006.01) ,C25D 3/38 (2006.01) ,C25D 21/06 (2006.01) ,C25D 5/34 (2006.01) ,C25D 5/48 (2006.01) ,H01M 4/66 (2006.01) ,H01M 4/13 (2010.01) ,H01M 10/052 (2010.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
04
Wires; Strips; Foils
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
38
of copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21
Processes for servicing or operating cells for electrolytic coating
06
Filtering
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
4
Electrodes
02
Electrodes composed of, or comprising, active material
64
Carriers or collectors
66
Selection of materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
4
Electrodes
02
Electrodes composed of, or comprising, active material
13
Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
10
Secondary cells; Manufacture thereof
05
Accumulators with non-aqueous electrolyte
052
Li-accumulators
Applicants:
케이씨에프테크놀로지스 주식회사 KCF TECHNOLOGIES CO., LTD. [KR/KR]; 경기도 안양시 동안구 엘에스로 116번길 39 39, LS-ro 116beon-gil, Dongan-gu, Anyang-si, Gyeonggi-do 14118, KR
Inventors:
김선화 JIN, Shan Hua; KR
이안나 LEE, An Na; KR
김승민 KIM, Seung Min; KR
Agent:
특허법인 천문 ASTRAN INT'L IP GROUP; 서울시 강남구 역삼로 233, 5층 (역삼동, 신성빌딩) (ShinSung Building, Yeoksam-dong) 5th Floor, 233, Yeoksam-ro, Gangnam-gu, Seoul 06225, KR
Priority Data:
10-2017-009666431.07.2017KR
Title (EN) ANTI-CREASING COPPER FOIL, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
(FR) FEUILLE DE CUIVRE RÉSISTANT AU PLISSEMENT , ÉLECTRODE LA COMPRENANT, BATTERIE RECHARGEABLE LA COMPRENANT ET SON PROCÉDÉ DE FABRICATION
(KO) 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
Abstract:
(EN) An embodiment of the present invention provides a copper foil, which comprises a copper layer having a matte surface and a shiny surface and an anti-rusting film disposed on the copper layer and has a residual stress of 0.5-25 Mpa based on an absolute value, the copper layer having crystalline faces, wherein in the sum of texture coefficients (TCs) of (111) face, (200) face, (220) face, and (311) face, which are the crystalline faces of the copper layer, the proportion [TCR(220)] of the texture coefficient of the (220) face [TC(220)] is 5-30%.
(FR) Selon un mode de réalisation, la présente invention concerne une feuille de cuivre, qui comprend une couche de cuivre ayant une surface mate et une surface brillante et un film anti-rouille disposé sur la couche de cuivre et présentant une contrainte résiduelle de 0,5 à 25 Mpa sur la base d'une valeur absolue, la couche de cuivre ayant des faces cristallines. Dans la somme des coefficients de texture (TC) de la face (111), de la face (200), de la face (220), et de la face (311), qui sont les faces cristallines de la couche de cuivre, la proportion [TCR (220)] du coefficient de texture de la face (220)] va de 5 à 30 %.
(KO) 본 발명의 일 실시예는, 매트면 및 샤이니면을 갖는 구리층 및 상기 구리층 상에 배치된 방청막을 포함하고, 절대값 기준으로 0.5 내지 25 Mpa의 잔류응력(residual stress)을 가지며, 상기 구리층은 결정면을 가지며, 상기 구리층의 결정면인 (111)면, (200)면, (220)면 및 (311)면의 집합조직계수(Texture coefficient, TC)의 합 중 (220)면의 집합조직계수[TC(220)]가 차지하는 비율[TCR(220)]이 5 내지 30%인 동박을 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)