Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019027014) METHOD FOR MANUFACTURING ORGANIC DEVICE, AND ORGANIC DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/027014 International Application No.: PCT/JP2018/029110
Publication Date: 07.02.2019 International Filing Date: 02.08.2018
IPC:
H05B 33/10 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/06 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/04 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
06
as the main or only constituent of a layer next to another layer of a specific substance
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
Applicants:
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP
Inventors:
藤井 貴志 FUJII Takashi; JP
松本 康男 MATSUMOTO Yasuo; JP
森島 進一 MORISHIMA Shinichi; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
三上 敬史 MIKAMI Takafumi; JP
Priority Data:
2017-15013902.08.2017JP
Title (EN) METHOD FOR MANUFACTURING ORGANIC DEVICE, AND ORGANIC DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF ORGANIQUE ET DISPOSITIF ORGANIQUE
(JA) 有機デバイスの製造方法及び有機デバイス
Abstract:
(EN) A method for manufacturing an organic device 1, including: a formation step for forming a plurality of organic device units 10 at prescribed intervals in one direction; an affixing step for affixing, along one direction, a sealing member 11 extending in one direction so that a part of a first electrode layer 5 and a part of a second electrode layer 9 of each of the organic device units 10 are exposed and so as to straddle a plurality of organic device units 10; and a cutting step for dividing the plurality of organic device units 10 to which the sealing member 11 has been affixed into individual pieces. In the affixing step, the sealing member 11, which has a sealing substrate 19 containing an electroconductive material and an adhesive part 17 containing a pressure-sensitive adhesive, is affixed to the organic device units 10. In the cutting step, a cutting blade B is inserted from the sealing member 11 side, and the sealing member 11 is cut so that the adhesive part 17 after being cut projects farther to the outside than the sealing substrate 19.
(FR) L'invention concerne un procédé de fabrication d'un dispositif organique (1). Le procédé de fabrication comprend : une étape de formation pour former plusieurs unités (10) de dispositif organique à des intervalles prédéfinis dans une direction ; une étape de fixation pour fixer, le long d'une direction, un élément d'étanchéité (11) s'étendant dans une direction de telle sorte qu'une partie d'une première couche d'électrode (5) et une partie d'une seconde couche d'électrode (9) de chacune des unités (10) de dispositif organique sont exposées et de sorte à chevaucher plusieurs unités (10) de dispositif organique ; et une étape de découpe pour diviser les unités (10) de dispositif organique auxquelles l'élément d'étanchéité (11) a été fixé en pièces individuelles. Lors de l'étape de fixation, l'élément d'étanchéité (11), qui comporte un substrat d'étanchéité (19) contenant un matériau électroconducteur et une partie adhésive (17) contenant un adhésif sensible à la pression, est fixé aux unités (10) de dispositif organique. Lors de l'étape de découpe, une lame de coupe (B) est insérée à partir du côté de l'élément d'étanchéité (11), et l'élément d'étanchéité (11) est coupé de telle sorte que la partie adhésive (17), après avoir été coupée, fait saillie plus loin vers l'extérieur que le substrat d'étanchéité (19).
(JA) 有機デバイス1の製造方法は、有機デバイス部10を一方向において所定の間隔をあけて複数形成する形成工程と、各有機デバイス部10における第1電極層5及び第2電極層9それぞれの一部が露出し且つ複数の有機デバイス部10に跨がるように、一方向に延在する封止部材11を一方向に沿って貼り合わせる貼合工程と、封止部材11が貼合された複数の有機デバイス部10を個片化する裁断工程と、を含み、貼合工程では、導電性を有する材料を含む封止基材19と、感圧接着剤を含む粘接着部17とを有する封止部材11を有機デバイス部10に貼り合わせ、裁断工程では、封止部材11側から裁断刃Bを進入させると共に、裁断された後の粘接着部17が封止基材19よりも外側に突出するように封止部材11を裁断する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)