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1. (WO2019026975) PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE
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Pub. No.: WO/2019/026975 International Application No.: PCT/JP2018/028924
Publication Date: 07.02.2019 International Filing Date: 01.08.2018
IPC:
H01L 23/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
Applicants:
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. [JP/JP]; 1, Kanai-cho, Sakae-ku, Yokohama-shi, Kanagawa 2440845, JP
Inventors:
INOUE Shingo; JP
Agent:
HASEGAWA Yoshiki; JP
KUROKI Yoshiki; JP
TAKAGI Kunio; JP
Priority Data:
2017-15003502.08.2017JP
Title (EN) PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE
(FR) PROCÉDÉ D'ASSEMBLAGE DE DISPOSITIF À SEMI-CONDUCTEUR
Abstract:
(EN) A process of assembling a semiconductor device is disclosed. The process includes steps of arraying metal bases on a carrier; applying sintered metal paste simultaneously onto the bases; disposing a substrate simultaneously onto the sintered metal paste where the substrate includes side walls corresponding to the bases and a wiring layer common the bases; and volatilizing solvent contained in the sintered metal paste.
(FR) L'invention concerne un procédé d'assemblage d'un dispositif à semi-conducteur. Le procédé comprend des étapes de mise en réseau de bases métalliques sur un support; appliquer simultanément une pâte métallique frittée sur les bases; disposer un substrat simultanément sur la pâte métallique frittée, le substrat comprenant des parois latérales correspondant aux bases et une couche de câblage commune aux bases; et volatiliser le solvant contenu dans la pâte métallique frittée.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)