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1. (WO2019026952) HEATSINK
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Pub. No.: WO/2019/026952 International Application No.: PCT/JP2018/028835
Publication Date: 07.02.2019 International Filing Date: 01.08.2018
IPC:
H01L 23/36 (2006.01) ,H01L 23/40 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
Applicants:
三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP/JP]; 東京都千代田区大手町一丁目3-2 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117, JP
Inventors:
渡邊 光太郎 WATANABE, Kotaro; JP
幸 俊彦 SAIWAI, Toshihiko; JP
Agent:
青山 正和 AOYAMA, Masakazu; JP
Priority Data:
2017-14984302.08.2017JP
Title (EN) HEATSINK
(FR) DISSIPATEUR DE CHALEUR
(JA) ヒートシンク
Abstract:
(EN) The purpose of the present invention is to improve the heat exchange performance of a heatsink. The heatsink includes: a substrate portion; a plurality of plate-like fin portions which rise integrally from a surface of the substrate portion and are arranged mutually in parallel, forming groove portions therebetween; and a porous body portion comprising at least one porous body with which the groove portions between the fin portions are filled and which has a three-dimensional mesh structure. The substrate portion and the fin portions comprise a solid non-porous material of aluminum. The porous body portion comprises a sintered body of aluminum fiber. The porous body portion is joined to the fin portions and the substrate portion via a sintered joint portion.
(FR) La présente invention a pour objet d'améliorer les performances d'échange de chaleur d'un dissipateur de chaleur. Le dissipateur de chaleur comprend : une partie de substrat ; une pluralité de parties d'ailette en forme de plaque qui s'élèvent d'un seul tenant à partir d'une surface de la partie de substrat et sont agencées mutuellement en parallèle, formant des parties de rainure entre elles ; et une partie de corps poreux comprenant au moins un corps poreux avec lequel les parties de rainure entre les parties d'ailette sont remplies et qui comporte une structure de maille tridimensionnelle. La partie de substrat et les parties d'ailette comprennent un matériau solide non poreux en aluminium. La partie de corps poreux comprend un corps fritté en fibre d'aluminium. La partie de corps poreux est unie aux parties d'ailette et à la partie de substrat par le biais d'une partie de jonction frittée.
(JA) ヒートシンクの熱交換性能を向上させる。 ヒートシンクは、基板部と、該基板部の表面に一体に立設され相互に平行に配置されて相互間に溝部を形成する複数のプレート状のフィン部と、前記フィン部間の前記溝部内に充填された三次元網目構造を有する少なくとも1つの多孔体からなる多孔体部とを有しており、前記基板部と前記フィン部とはアルミニウムの中実な非多孔質材からなり、前記多孔体部はアルミニウム繊維の焼結体からなり、前記多孔体部は前記フィン部及び前記基板部に焼結接合部を介して接合されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)