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1. (WO2019026927) THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
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Pub. No.: WO/2019/026927 International Application No.: PCT/JP2018/028730
Publication Date: 07.02.2019 International Filing Date: 31.07.2018
IPC:
C08L 23/16 (2006.01) ,B32B 15/08 (2006.01) ,C08K 9/04 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
16
Ethene-propene or ethene-propene-diene copolymers
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9
Use of pretreated ingredients
04
Ingredients treated with organic substances
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
青木 幸一 AOKI, Kouichi; --
Agent:
特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE; 大阪府大阪市北区梅田1‐12‐17 梅田スクエアビル9F Umeda Square Bldg., 9F., 1-12-17, Umeda, Kita-ku, Osaka-shi, Osaka 5300001, JP
Priority Data:
2017-15006102.08.2017JP
Title (EN) THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
(FR) COMPOSITION THERMODURCISSABLE, COUCHE DE RÉSINE, FEUILLE MÉTALLIQUE DOTÉE D'UNE RÉSINE, STRATIFIÉ À REVÊTEMENT MÉTALLIQUE ET CARTE À CIRCUITS IMPRIMÉS
(JA) 熱硬化性組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
Abstract:
(EN) The present disclosure provides a thermosetting composition the cured product of which can have a low dielectric constant, a low dielectric loss tangent, high heat resistance, and high adhesiveness to resins. The thermosetting composition according to the present disclosure contains an ethylene-propylene-diene copolymer (A) and an inorganic filler (B) that has been surface-treated by a surface treatment agent having a polymerizable unsaturated bond.
(FR) La présente invention concerne une composition thermodurcissable dont le produit durci peut avoir une faible constante diélectrique, une faible tangente de perte diélectrique, une résistance à la chaleur élevée et une adhésivité élevée aux résines. La composition thermodurcissable selon la présente invention contient un copolymère éthylène-propylène-diène (A) et une charge inorganique (B) qui a été traitée en surface par un agent de traitement de surface ayant une liaison insaturée polymérisable.
(JA) 本開示は、その硬化物が低い誘電率、低い誘電正接、高い耐熱性、及び樹脂に対する高い密着性を有しうる熱硬化性組成物を提供する。本開示に係る熱硬化性組成物は、エチレン-プロピレン-ジエン共重合体(A)と、重合性不飽和結合を有する表面処理剤で表面処理された無機充填材(B)とを含有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)