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1. (WO2019026916) FRAME FEEDER
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Pub. No.: WO/2019/026916 International Application No.: PCT/JP2018/028700
Publication Date: 07.02.2019 International Filing Date: 31.07.2018
IPC:
H01L 21/60 (2006.01) ,H01L 21/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo 2088585, JP
Inventors:
長野 一昭 NAGANO, Kazuaki; JP
Agent:
特許業務法人YKI国際特許事務所 YKI INTELLECTUAL PROPERTY ATTORNEYS; 東京都武蔵野市吉祥寺本町一丁目34番12号 1-34-12, Kichijoji-Honcho, Musashino-shi, Tokyo 1800004, JP
Priority Data:
2017-14894201.08.2017JP
Title (EN) FRAME FEEDER
(FR) DISPOSITIF D'ALIMENTATION DE CADRE
(JA) フレームフィーダ
Abstract:
(EN) This invention is provided with a heat plate (11) for heating the lower side of a substrate (75) sliding on the upper surface (11a) thereof, and a heat block (20) for heating the heat plate (11). The heat block (20) has an air heating channel (25) for heating air which has flowed in from the bottom surface (13b) side and causing the air to flow out on the heat plate (11) side. The heat plate (11) has air holes (12) for discharging air heated by the air heating channel (25) from the upper surface. The heated air discharged from the air holes (12) forms a heated air atmosphere (90) on the upper side of the heat plate (11), and a substrate (75) is transported through the heated air atmosphere (90). Curvature deformation of the substrate is thereby prevented.
(FR) La présente invention comporte une plaque thermique (11) destinée à chauffer le côté inférieur d'un substrat (75) coulissant sur la surface supérieure (11a) de celle-ci, et un bloc thermique (20) destiné à chauffer la plaque thermique (11). Le bloc thermique (20) a un canal de chauffage d'air (25) destiné à chauffer l'air qui s'est écoulé depuis le côté surface inférieure (13b) et à amener l'air à s'écouler vers l'extérieur du côté plaque thermique (11). La plaque thermique (11) comporte des trous d'air (12) destinés à évacuer l'air chauffé par le canal de chauffage d'air (25) depuis la surface supérieure. L'air chauffé évacué par les trous d'air (12) forme une atmosphère d'air chauffé (90) sur le côté supérieur de la plaque thermique (11), et un substrat (75) est transporté à travers l'atmosphère d'air chauffé (90). Une déformation de courbure du substrat est ainsi empêchée.
(JA) 上面(11a)を滑走する基板(75)の下側を加熱するヒートプレート(11)と、ヒートプレート(11)を加熱するヒートブロック(20)と、を備え、ヒートブロック(20)は、底面(13b)側から流入した空気を加熱してヒートプレート(11)の側に流出させる空気加熱流路(25)を備え、ヒートプレート(11)は、空気加熱流路(25)で加熱された空気を上面から噴き出す空気孔(12)を備え、空気孔(12)から噴出した加熱空気は、ヒートプレート(11)の上側に加熱空気雰囲気(90)を形成し、基板(75)が加熱空気雰囲気(90)を通って搬送される。これにより、基板の湾曲変形を抑制する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)