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1. (WO2019026902) HIGH FREQUENCY MODULE
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Pub. No.: WO/2019/026902 International Application No.: PCT/JP2018/028649
Publication Date: 07.02.2019 International Filing Date: 31.07.2018
IPC:
H01L 23/29 (2006.01) ,H01L 23/00 (2006.01) ,H01L 23/28 (2006.01) ,H01L 25/00 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
大坪 喜人 OTSUBO, Yoshihito; JP
藤井 亮宏 FUJII, Akihiro; JP
Agent:
梁瀬 右司 YANASE, Yuji; JP
木村 公一 KIMURA, Koichi; JP
丸山 陽介 MARUYAMA, Yosuke; JP
Priority Data:
2017-14885101.08.2017JP
Title (EN) HIGH FREQUENCY MODULE
(FR) MODULE HAUTE FRÉQUENCE
(JA) 高周波モジュール
Abstract:
(EN) Provided is a module which has improved heat dissipation efficiency, while being prevented from warping and deformation of the module. This module 1 is provided with: a substrate 2; a first component 4 that is mounted on an upper surface 2a of the substrate 2; a heat dissipation member 8; and a sealing resin layer 9 that seals the first component 4 and the heat dissipation member 8. The heat dissipation member 8 is formed to have a larger area than the first component 4 when viewed from a direction that is perpendicular to the upper surface 2a of the substrate 2, and prevents heat generation in the module 1 by transferring the heat generated by the first component 4 to the outside of the module. In addition, the heat dissipation member 8 is provided with a through hole 14, and separation of the sealing resin layer 9 is able to be prevented by having a resin filled also into the through hole.
(FR) L'invention concerne un module qui présente une efficacité de dissipation de chaleur améliorée, tout en étant empêché de gauchissement et de déformation. Ce module 1 comprend : un substrat 2 ; un premier composant 4 qui est monté sur une surface supérieure 2a du substrat 2 ; un élément de dissipation de chaleur 8; et une couche de résine d'étanchéité 9 qui scelle le premier composant 4 et l'élément de dissipation de chaleur 8. L'élément de dissipation de chaleur 8 est formé de façon à avoir une surface plus grande que le premier composant 4 lorsqu'il est vu depuis une direction qui est perpendiculaire à la surface supérieure 2a du substrat 2, et empêche la génération de chaleur dans le module 1 en transférant la chaleur générée par le premier composant 4 vers l'extérieur du module. De plus, l'élément de dissipation de chaleur 8 comprend un trou traversant 14, et la séparation de la couche de résine d'étanchéité 9 peut être empêchée en ayant une résine chargée également dans le trou traversant.
(JA) 放熱効率の向上を図り、モジュールの反りや変形を防止することができるモジュールを提供する。 モジュール1は、基板2と基板2の上面2aに実装された第1部品4と、放熱部材8と、第1部品4および放熱部材8とを封止する封止樹脂層9とを備える。放熱部材8は、基板2の上面2aと垂直な方向からみたときに、第1部品4の面積よりも大きく形成され、第1部品4から発生した熱をモジュールの外部へ逃がすことにより、モジュール1の発熱を防止する。また、放熱部材8には、貫通孔14が設けられており、樹脂が貫通孔にも充填されることで、封止樹脂層9の剥離を防止することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)