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1. (WO2019026829) METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, AND METAL NANOWIRE INK
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/026829 International Application No.: PCT/JP2018/028412
Publication Date: 07.02.2019 International Filing Date: 30.07.2018
IPC:
H01B 13/00 (2006.01) ,B05D 5/12 (2006.01) ,B05D 7/04 (2006.01) ,B05D 7/24 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/18 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/22 (2006.01) ,H01B 5/14 (2006.01) ,H05K 1/09 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
12
to obtain a coating with specific electrical properties
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
02
to macromolecular substances, e.g. rubber
04
to surfaces of films or sheets
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
24
for applying particular liquids or other fluent materials
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
昭和電工株式会社 SHOWA DENKO K.K. [JP/JP]; 東京都港区芝大門一丁目13番9号 13-9, Shiba Daimon 1-Chome, Minato-ku, Tokyo 1058518, JP
Inventors:
山木 繁 YAMAKI Shigeru; JP
Agent:
在原 元司 ARIHARA Motoji; JP
Priority Data:
2017-14980602.08.2017JP
Title (EN) METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, AND METAL NANOWIRE INK
(FR) PROCÉDÉ DE PRODUCTION D'UN FILM CONDUCTEUR, FILM CONDUCTEUR ET ENCRE À NANOFILS MÉTALLIQUES
(JA) 導電フィルムの製造方法、導電フィルム及び金属ナノワイヤインク
Abstract:
(EN) [Problem] Provided is a conducive film for which the amount of a metal nanowire to be used can be reduced, and which has a surface resistivity ranging from 1000 to 10000 Ω/□, and has a small degree of variation in in-plane surface resistivities. Also provided are: a method suitable for the production of a conductive film, which has excellent production efficiency; and a metal nanowire ink which can be used for the method. [Solution] A conductive film which can be produced by a production method including a step of applying a metal nanowire ink onto at least one surface of a polymer film and then drying the metal nanowire ink, wherein the metal nanowire ink contains a metal nanowire (A) having an average diameter of 1 to 100 nm, an average long axis length of 1 to 100 μm and an average aspect ratio of 100 to 2000, a binder resin (B) containing at least one of ethyl cellulose and hydroxypropyl cellulose and a solvent (C) containing diethylene glycol monoethyl ether, the content of the metal nanowire (A) in the metal nanowire ink is 0.005 to 0.05% by mass, the surface resistivity of a conductive layer in the conductive film is 1000 to 10000 Ω/□, and the degree of variation in the in-plane surface resistivity is 35% or less.
(FR) Le problème décrit par la présente invention est de fournir un film conducteur pour lequel la quantité d'un nanofil métallique à utiliser peut être réduite, et qui a une résistivité de surface allant de 1000 à 10000 Ω/□, et a un faible degré de variation dans des résistivités de surface dans le plan. L'invention concerne également : un procédé approprié pour la production d'un film conducteur, qui a un excellent rendement de production; et une encre à nanofils métalliques qui peut être utilisée pour le procédé. La solution selon l'invention porte sur un film conducteur qui peut être produit par un procédé de production comprenant une étape d'application d'une encre à nanofils métalliques sur au moins une surface d'un film polymère et ensuite le séchage de l'encre à nanofils métalliques, l'encre à nanofils métalliques contenant un nanofil métallique (A) ayant un diamètre moyen de 1 à 100 nm, une longueur moyenne d'axe long de 1 à 100 µm et un rapport d'aspect moyen de 100 à 2000, une résine liante (B) contenant au moins l'une de la cellulose d'éthyle et de la cellulose d'hydroxypropyle et un solvant (C) contenant de l'éther monoéthylique de diéthylène glycol, la teneur du nanofil métallique (A) dans l'encre de nanofil métallique étant de 0,005 à 0,05 % en masse, la résistivité de surface d'une couche conductrice dans le film conducteur est de 1000 à 10000 Ω/□, et le degré de variation de la résistivité de surface dans le plan est d'au maximum 35 %.
(JA) 【課題】金属ナノワイヤの使用量を抑え、1000~10000Ω/□の範囲の表面抵抗値を有する、面内の表面抵抗値のばらつきが小さい導電フィルムを提供する。さらには生産性に優れた導電フィルムの好適な製造方法及びそのための金属ナノワイヤインクを提供する。 【解決手段】平均径が1~100nm、長軸の長さの平均が1~100μmであり、且つアスペクト比の平均が100~2000である金属ナノワイヤ(A)と、エチルセルロース及びヒドロキシプロピルセルロースの少なくとも一方を含むバインダー樹脂(B)と、ジエチレングリコールモノエチルエーテルを含む溶剤(C)と、を含み、金属ナノワイヤ(A)の含有率が0.005~0.05質量%である金属ナノワイヤインクを、高分子フィルムの少なくとも片面に塗布、乾燥させる工程を含む製造方法により得られる、導電層の表面抵抗値が1000~10000Ω/□であり、且つ面内の表面抵抗値のばらつきが35%以下である導電フィルムである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)