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1. (WO2019026806) POLYIMIDE VARNISH AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/026806 International Application No.: PCT/JP2018/028315
Publication Date: 07.02.2019 International Filing Date: 27.07.2018
IPC:
C08L 79/08 (2006.01) ,C08G 73/10 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/08 (2006.01) ,C08K 5/1535 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
02
Elements
08
Metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
15
Heterocyclic compounds having oxygen in the ring
151
having one oxygen atom in the ring
1535
Five-membered rings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Applicants:
旭化成株式会社 ASAHI KASEI KABUSHIKI KAISHA [JP/JP]; 東京都千代田区有楽町一丁目1番2号 1-1-2 Yurakucho, Chiyoda-ku, Tokyo 1000006, JP
Inventors:
加藤 聡 KATO, Satoshi; JP
長澤 俊明 NAGASAWA, Toshiaki; JP
Agent:
青木 篤 AOKI, Atsushi; JP
三橋 真二 MITSUHASHI, Shinji; JP
中村 和広 NAKAMURA, Kazuhiro; JP
齋藤 都子 SAITO, Miyako; JP
三間 俊介 MIMA, Shunsuke; JP
明石 尚久 AKASHI, Naohisa; JP
Priority Data:
2017-15008202.08.2017JP
Title (EN) POLYIMIDE VARNISH AND METHOD FOR PRODUCING SAME
(FR) VERNIS POLYIMIDE ET SON PROCÉDÉ DE PRODUCTION
(JA) ポリイミドワニス及びその製造方法
Abstract:
(EN) The purpose of the present invention is to provide: a polyimide film having high transparency and improved bending resistance against multiple times of bending; and a varnish capable of providing such a polyimide film. The varnish according to the present invention contains a polymer (α) and a solvent (β). The polymer (α) is a polyimide or a polyimide precursor. The varnish further contains a typical metal element having an atomic weight of 26-201 except alkali metals and alkaline earth metals, or at least one metal element among transition metal elements having an atomic weight of 26-201. At least one of the metal elements contained in the varnish is present in an amount of 0.05-500 ppm relative to the polymer (α).
(FR) L'objet de la présente invention est de pourvoir à : un film polyimide doué d'une transparence élevée et d'une résistance à la flexion améliorée lors de multiples essais de mise en flexion ; et un vernis capable de former ledit film polyimide. Le vernis selon la présente invention contient un polymère (α) et un solvant (β). Le polymère (α) est un polyimide ou un précurseur de polyimide. Le vernis contient en outre un élément métallique classique ayant un poids atomique de 26 à 201, exceptions faites des métaux alcalins et des métaux alcalino-terreux, ou au moins un élément métallique parmi les éléments de type métaux de transition ayant un poids atomique de 26 à 201. Au moins un des éléments métalliques contenus dans le vernis est présent en une quantité de 0,05 à 500 ppm par rapport au polymère (α).
(JA) 本発明は、透明性が高く、かつ複数回の屈曲に対する屈曲耐性が改善されたポリイミドフィルム、及びこれを提供することのできるワニスを提供することを目的とする。本発明のワニスは、ポリマー(α)と溶媒(β)とを含む。上記ポリマー(α)は、ポリイミドまたはポリイミド前駆体である。上記ワニスは、アルカリ金属およびアルカリ土類金属を除く、原子量が26以上201以下である典型金属元素、又は、原子量が26以上201以下である遷移金属元素に属する少なくとも1種の金属元素を更に含む。上記ワニスに含まれる上記金属元素のうち少なくとも1種は、上記ポリマー(α)に対して0.05~500ppmの量で存在する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)