Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019026799) COMPOSITION FOR METAL BONDING, METAL BONDED LAMINATE AND ELECTRIC CONTROL DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/026799 International Application No.: PCT/JP2018/028293
Publication Date: 07.02.2019 International Filing Date: 27.07.2018
IPC:
B22F 9/00 (2006.01) ,B22F 1/00 (2006.01) ,B22F 3/24 (2006.01) ,B22F 7/08 (2006.01) ,B82Y 30/00 (2011.01) ,H01L 21/52 (2006.01) ,B22F 1/02 (2006.01) ,B22F 9/30 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
9
Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3
Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
24
After-treatment of workpieces or articles
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
7
Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
06
of composite workpieces or articles from parts, e.g. to form tipped tools
08
with one or more parts not made from powder
B PERFORMING OPERATIONS; TRANSPORTING
82
NANO-TECHNOLOGY
Y
SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES
30
Nano-technology for materials or surface science, e.g. nano-composites
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02
comprising coating of the powder
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
9
Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
16
using chemical processes
30
with decomposition of metal compounds, e.g. by pyrolysis
Applicants:
バンドー化学株式会社 BANDO CHEMICAL INDUSTRIES, LTD. [JP/JP]; 兵庫県神戸市中央区港島南町4丁目6番6号 6-6, Minatojima Minamimachi 4-chome, Chuo-ku, Kobe-shi, Hyogo 6500047, JP
Inventors:
渡辺 智文 WATANABE, Tomofumi; JP
田中 啓資 TANAKA, Keisuke; JP
Agent:
特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES; 大阪府大阪市淀川区宮原3丁目5番36号 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2017-14831731.07.2017JP
Title (EN) COMPOSITION FOR METAL BONDING, METAL BONDED LAMINATE AND ELECTRIC CONTROL DEVICE
(FR) COMPOSITION DESTINÉE À UNE LIAISON DE MÉTAL, STRATIFIÉ DE LIAISON DE MÉTAL ET DISPOSITIF DE COMMANDE ÉLECTRIQUE
(JA) 金属接合用組成物、金属接合積層体及び電気制御機器
Abstract:
(EN) The present invention provides: a composition for metal bonding, which is suitable for the formation of a metal bonded material that exhibits excellent durability in terms of a thermal load that is applied thereto during a heat cycle test and the like; a metal bonded laminate wherein bonding of metal surfaces is achieved by firing the above-described composition for metal bonding; and an electric control device. A composition for metal bonding according to the present invention is used for the purpose of bonding metal surfaces by means of firing; and this composition for metal bonding contains silver particles and a dispersion medium. The silver particles comprise nanoparticles that have particle diameters of 1-99 nm, and submicron particles that have particle diameters of 100-999 nm and/or micron particles that have particle diameters of 1-999 μm. A film of this composition for metal bonding fired at 275°C has a tensile stress at break of 100 MPa or more.
(FR) La présente invention concerne : une composition pour une liaison de métal, qui est appropriée pour la formation d'un matériau de liaison de métal qui fait preuve d'une excellente durabilité lorsqu'une charge thermique lui est appliquée pendant un essai de cycle thermique et similaire ; un stratifié de liaison de métal, la liaison de surfaces métalliques étant obtenue par cuisson de la composition pour une liaison de métal décrite ci-dessus ; et un dispositif de commande électrique. Selon la présente invention, la composition pour une liaison de métal est utilisée dans le but de lier des surfaces métalliques au moyen d'une cuisson ; et la composition pour une liaison de métal contient des particules d'argent et un milieu de dispersion. Les particules d'argent comprennent des nanoparticules qui possèdent des diamètres de particule de 1 à 99 nm, et des particules submicroniques, qui possèdent des diamètres de particule de 100 à 999 nm, et/ou des particules microniques, qui possèdent des diamètres de particule de 1 à 999 µm.Un film de la composition pour une liaison de métal cuit à 275 °C possède une contrainte de traction à la rupture supérieure ou égale à 100 MPa.
(JA) 本発明は、ヒートサイクル試験等で加わる熱的負荷に対する耐久性に優れた金属接合材の形成に適した金属接合用組成物、並びに、上記金属接合用組成物を焼成することによって金属面の接合が行われた金属接合積層体及び電気制御機器を提供する。本発明の金属接合用組成物は、焼成して金属面を接合するために用いられる金属接合用組成物であって、上記金属接合用組成物は、銀粒子及び分散媒を含有し、上記銀粒子は、粒径1~99nmのナノ粒子と、粒径100~999nmのサブミクロン粒子及び/又は粒径1~999μmのミクロン粒子とを含むものであり、275℃で焼成したときの被膜の引張破断応力が100MPa以上である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)