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1. (WO2019026772) PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, PRINTED WIRING BOARD, SEMICONDUCTOR ELEMENT, AND ELECTRONIC COMPONENT
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Pub. No.: WO/2019/026772 International Application No.: PCT/JP2018/028137
Publication Date: 07.02.2019 International Filing Date: 26.07.2018
IPC:
G03F 7/004 (2006.01) ,C08G 73/22 (2006.01) ,G03F 7/023 (2006.01) ,H05K 3/28 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
22
Polybenzoxazoles
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
太陽ホールディングス株式会社 TAIYO HOLDINGS CO., LTD. [JP/JP]; 埼玉県比企郡嵐山町大字大蔵388番地 388, Ohaza Ohkura, Ranzan-machi, Hiki-gun, Saitama 3550222, JP
Inventors:
本松 譲 MOTOMATSU Joh; JP
秋元 真歩 AKIMOTO Maho; JP
福島 智美 FUKUSHIMA Satomi; JP
Agent:
本多 一郎 HONDA Ichiro; JP
Priority Data:
2017-14860931.07.2017JP
2017-14861031.07.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, PRINTED WIRING BOARD, SEMICONDUCTOR ELEMENT, AND ELECTRONIC COMPONENT
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM SEC, PRODUIT DURCI, CARTE DE CIRCUITS IMPRIMÉS, ÉLÉMENT SEMI-CONDUCTEUR ET COMPOSANT ÉLECTRONIQUE
(JA) 感光性樹脂組成物、ドライフィルム、硬化物、プリント配線板、半導体素子および電子部品
Abstract:
(EN) Provided are: a photosensitive resin composition which can be cured at a lower temperature of lower than 300°C and cannot corrode a metallic wire; a dry film; a cured article; a printed wiring board; and an electronic component. The photosensitive resin composition according to the present invention contains (A) an alkali-soluble resin, (B) a photosensitive agent and (C) at least one of a compound represented by general formula (1) and a compound represented by general formula (2). In general formula (1), at least one of X1 to X3 represents a -OH group or -OR (wherein R represents an organic group) group. In general formula (2), n represents an integer of 1 to 1000.
(FR) L'invention concerne : une composition de résine photosensible qui peut être durcie à une température inférieure à 300°C et qui ne peut pas corroder un fil métallique ; un film sec ; un produit durci ; une carte de circuits imprimés ; et un composant électronique. Selon la présente invention, la composition de résine photosensible contient (A) une résine soluble dans les alcalis, (B) un agent photosensible et (C) au moins un composé représenté par la formule générale (1) et un composé représenté par la formule générale (2). Dans la formule générale (1), au moins un des X1 à X3 représente un groupe -OH ou -OR (où R représente un groupe organique). Dans la formule générale (2), n représente un entier compris entre 1 et 1000.
(JA) 300℃未満の低温で硬化し金属配線を腐食させることがない感光性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品を提供する。 本発明の感光性樹脂組成物は、(A)アルカリ可溶性樹脂と、(B)感光剤と、(C)一般式(1)および一般式(2)で表される化合物の少なくとも一つと、を含む。上記一般式(1)中、X~Xのうち少なくとも一つは、-OH基または-OR(Rは有機基)基であり、上記一般式(2)中、nは、1~1000の整数である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)