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1. (WO2019026745) THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE
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Pub. No.: WO/2019/026745 International Application No.: PCT/JP2018/028025
Publication Date: 07.02.2019 International Filing Date: 26.07.2018
IPC:
C08L 101/00 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/26 (2006.01) ,C08K 3/38 (2006.01) ,H05K 7/20 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
24
Acids; Salts thereof
26
Carbonates; Bicarbonates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
バンドー化学株式会社 BANDO CHEMICAL INDUSTRIES, LTD. [JP/JP]; 兵庫県神戸市中央区港島南町4丁目6番6号 6-6, Minatojima Minamimachi 4-chome, Chuo-ku, Kobe-shi, Hyogo 6500047, JP
Inventors:
山浦 孝太郎 YAMAURA, Kotaro; JP
向 史博 MUKAI, Fumihiro; JP
細川 祐希 HOSOKAWA, Yuki; JP
Agent:
特許業務法人サンクレスト国際特許事務所 SUNCREST PATENT AND TRADEMARK ATTORNEYS; 兵庫県神戸市中央区栄町通四丁目1番11号 1-11, Sakaemachidori 4-chome, Chuo-ku, Kobe-shi, Hyogo 6500023, JP
Priority Data:
2017-14826631.07.2017JP
Title (EN) THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE
(FR) ARTICLE MOULÉ EN RÉSINE THERMOCONDUCTRICE
(JA) 熱伝導性樹脂成型品
Abstract:
(EN) A thermally conductive resin molded article including a resin and a thermally conductive filler that includes a first thermally conductive filler and a second thermally conductive filler having a smaller grain size than the first thermally conductive filler, wherein the thermally conductive filler content is 30-50% by volume, the first thermally conductive filler comprises boron nitride having a grain size of 30 μm or greater and an aspect ratio of 10 or higher, the first thermally conductive foller content is 5-20% by volume, and the second thermally conductive filler comprises a material other than boron nitride.
(FR) La présente invention concerne un article moulé en résine thermoconductrice comprenant une résine et une charge thermoconductrice qui comprend une première charge thermoconductrice et une seconde charge thermoconductrice ayant une taille de grain inférieure à celle de la première charge thermoconductrice, la teneur en charges thermoconductrices étant de 30 à 50 % en volume. La première charge thermoconductrice comprend du nitrure de bore ayant une taille de grain de 30 µm ou plus et un rapport de forme de 10 ou plus, la teneur de la première charge thermoconductrice est de 5 à 20 % en volume, et la seconde charge thermoconductrice comprend un matériau autre que le nitrure de bore.
(JA) 樹脂と、第1熱伝導性フィラー及び前記第1熱伝導性フィラーより小さい粒径を有する第2熱伝導性フィラーを含む熱伝導性フィラーと、を含む熱伝導性樹脂成型品であって、前記熱伝導性フィラーの含有量は、30~50体積%であり、前記第1熱伝導性フィラーは、30μm以上の粒径及び10以上のアスペクト比を有する窒化ホウ素からなるフィラーであり、前記第1熱伝導性フィラーの含有量は、5~20体積%であり、前記第2熱伝導性フィラーは、窒化ホウ素以外の材質からなるフィラーである、熱伝導性樹脂成型品。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)