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1. (WO2019026614) METHOD FOR JOINING DISSIMILAR METALS, AND LASER WELDING DEVICE
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Pub. No.: WO/2019/026614 International Application No.: PCT/JP2018/026821
Publication Date: 07.02.2019 International Filing Date: 18.07.2018
IPC:
B23K 26/323 (2014.01) ,B23K 26/211 (2014.01)
[IPC code unknown for B23K 26/323][IPC code unknown for B23K 26/211]
Applicants:
株式会社UACJ UACJ CORPORATION [JP/JP]; 東京都千代田区大手町一丁目7番2号 1-7-2, Otemachi, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
蓬田 翔平 YOMOGIDA Shohei; JP
村瀬 崇 MURASE Takashi; JP
福田 敏彦 FUKUDA Toshihiko; JP
Agent:
アインゼル・フェリックス=ラインハルト EINSEL Felix-Reinhard; JP
前川 純一 MAEKAWA Junichi; JP
二宮 浩康 NINOMIYA Hiroyasu; JP
上島 類 UESHIMA Rui; JP
Priority Data:
2017-14777031.07.2017JP
Title (EN) METHOD FOR JOINING DISSIMILAR METALS, AND LASER WELDING DEVICE
(FR) PROCÉDÉ D'ASSEMBLAGE DE MÉTAUX DISSEMBLABLES ET DISPOSITIF DE SOUDAGE AU LASER
(JA) 異種金属の接合方法およびレーザ溶接装置
Abstract:
(EN) This method for joining dissimilar metals involves joining an Al-based parent material (2) comprising an Al alloy or pure Al and a Cu-based parent material (3) comprising a Cu alloy or pure Cu, wherein a welding material (5) comprising an Al alloy that contains Si and/or Cu is used to join the Al-based parent material (2) and the Cu-based parent material (3) through laser welding in which an irradiated portion that is irradiated by laser light is melted and solidified.
(FR) L'invention concerne un procédé d'assemblage de métaux dissemblables consistant à assembler un matériau parent à base d'Al (2) comprenant un alliage d'Al ou de l'Al pur et un matériau parent à base de Cu (3) comprenant un alliage de Cu ou du Cu pur, un matériau de soudage (5) comprenant un alliage d'Al qui contient du Si et/ou du Cu étant utilisé pour assembler le matériau parent à base d'Al (2) et le matériau parent à base de Cu (3) par soudage au laser dans lequel une partie irradiée qui est irradiée par de la lumière laser est fondue et solidifiée.
(JA) 異種金属の接合方法では、Al合金もしくは純AlからなるAl系母材(2)と、Cu合金もしくは純CuからなるCu系母材(3)との異種金属の接合方法であって、SiおよびCuの少なくとも一方を含有するAl合金からなる溶加材(5)を用い、レーザ光の照射によって照射した部分を溶融・凝固させるレーザ溶接により、Al系母材(2)とCu系母材(3)とを接合する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)