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1. (WO2019026578) POSITIVE ELECTRODE FOR ELECTROLYTIC COPPER PLATING AND ELECTROLYTIC COPPER PLATING APPARATUS USING SAME
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Pub. No.: WO/2019/026578 International Application No.: PCT/JP2018/026178
Publication Date: 07.02.2019 International Filing Date: 11.07.2018
IPC:
C25D 17/10 (2006.01) ,C25D 21/00 (2006.01) ,C25D 21/12 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17
Constructional parts, or assemblies thereof, of cells for electrolytic coating
10
Electrodes
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21
Processes for servicing or operating cells for electrolytic coating
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21
Processes for servicing or operating cells for electrolytic coating
12
Process control or regulation
Applicants:
メルテックス株式会社 MELTEX INC. [JP/JP]; 東京都中央区日本橋本町四丁目8番2号 4-8-2 Nihonbashi Honcho, Chuo-ku, Tokyo 1030023, JP
Inventors:
塚原 義人 TSUKAHARA, Yoshito; JP
重松 利幸 SHIGEMATSU Toshiyuki; JP
Agent:
吉村 勝博 YOSHIMURA, Katsuhiro; JP
Priority Data:
2017-14770731.07.2017JP
Title (EN) POSITIVE ELECTRODE FOR ELECTROLYTIC COPPER PLATING AND ELECTROLYTIC COPPER PLATING APPARATUS USING SAME
(FR) ÉLECTRODE POSITIVE DESTINÉE À UN PLACAGE ÉLECTROLYTIQUE DE CUIVRE ET APPAREIL DE PLACAGE ÉLECTROLYTIQUE DE CUIVRE UTILISANT LADITE ÉLECTRODE POSITIVE
(JA) 電解銅めっき用陽極、及びそれを用いた電解銅めっき装置
Abstract:
(EN) The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the complexity of the apparatus structure; and an electrolytic copper plating apparatus using the same. To achieve said purpose, a positive electrode for electrolytic copper plating that is to be disposed in an electrolysis tank in which an electrolytic copper plating solution is stored, is characterized in that: said electrolytic copper plating solution is an acidic electrolytic copper plating solution containing a disulfide compound; and said positive electrode is provided such that a soluble copper positive electrode and an insoluble positive electrode are electrically connected.
(FR) Le but de la présente invention est de fournir : une électrode positive destinée à un placage électrolytique de cuivre, permettant d'améliorer des caractéristiques de placage telles qu'une facilitation de placage et des propriétés de remplissage de trous d’interconnexion, sans augmenter la complexité de la structure d'appareil ; et un appareil de placage électrolytique de cuivre utilisant ladite électrode positive. Pour atteindre ce but, une électrode positive destinée à un placage électrolytique de cuivre, qui doit être disposée dans un réservoir d'électrolyse dans lequel est stockée une solution de placage électrolytique de cuivre, est caractérisée en ce que : ladite solution de placage électrolytique de cuivre est une solution de placage électrolytique de cuivre acide contenant un composé disulfure ; et ladite électrode positive est agencée de sorte qu'une électrode positive de cuivre soluble et une électrode positive insoluble soient électriquement connectées.
(JA) 装置構造を複雑化させずに、めっき促進性やビアフィリング性等のめっき特性の向上を図ることが出来る電解銅めっき用陽極及びそれを用いた電解銅めっき装置を提供することを目的とする。この目的を達成するため、電解銅めっき液が貯留された電解処理槽内に配設する陽極であって、当該電解銅めっき液が、ジスルフィド化合物を含有した酸性電解銅めっき液であり、当該陽極が、溶解性銅陽極と不溶性陽極とを電気的に接続した状態で備えたことを特徴とする電解銅めっき用陽極を採用する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)