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1. (WO2019026561) CRIMP STRUCTURE OF WIRE AND SHIELDED CONDUCTION PATH
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Pub. No.: WO/2019/026561 International Application No.: PCT/JP2018/025944
Publication Date: 07.02.2019 International Filing Date: 10.07.2018
Chapter 2 Demand Filed: 20.11.2018
IPC:
H01R 13/6581 (2011.01) ,H01R 4/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
648
Protective earth or shield arrangements on coupling devices
658
High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] 
6581
Shield structure
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
10
effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
18
by crimping
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
浜田 和明 HAMADA, Kazuaki; JP
村田 敦 MURATA, Atsushi; JP
Agent:
特許業務法人グランダム特許事務所 GRANDOM PATENT LAW FIRM; 愛知県名古屋市中区栄二丁目4番1号 広小路栄ビルディング3階 Hirokoji Sakae Bldg. 3F, 4-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2017-14763931.07.2017JP
Title (EN) CRIMP STRUCTURE OF WIRE AND SHIELDED CONDUCTION PATH
(FR) STRUCTURE DE SERTISSAGE DE FIL ET TRAJET DE CONDUCTION BLINDÉ
(JA) 電線の圧着構造及びシールド導電路
Abstract:
(EN) The purpose of the present invention is to improve the strength of fixation between a wire and a crimped part. A crimped part (25) constituting a connection structure for a shielded wire (11) is provided with: a substrate part (30) disposed along the outer circumference of the shielded wire (11); a first crimp part (31) extended in a cantilever shape from one side edge of the substrate part (30) in the circumferential direction of the shielded wire (11), and crimped so as to enclose the outer circumference of the shielded wire (11); a second crimp part (36) extended in a cantilever shape from the other side edge of the substrate part (30) in the circumferential direction in the opposite direction to that of the first crimp part (31), and crimped so as to enclose the outer circumference of the shielded wire (11); and a restricting part (46) disposed along the outer circumference of the shielded wire (11), the restricting part (46) causing a first engaging part (34) of the first crimp part (31) and a second engaging part (39) of the second crimp part (36) to engage with each other in the circumferential direction in opposite directions with respect to each other.
(FR) Le but de la présente invention est d'améliorer l'intensité de fixation entre un fil et une partie sertie Une partie sertie (25) constituant une structure de connexion pour un fil blindé (11) comprend : une partie de substrat (30) disposée le long de la circonférence externe du fil blindé (11); une première partie de sertissage (31) s'étendant en forme de porte-à-faux à partir d'un bord latéral de la partie de substrat (30) dans la direction circonférentielle du fil blindé (11), et sertie de manière à entourer la circonférence externe du fil blindé (11); une seconde partie de sertissage (36) s'étendant dans une forme en porte-à-faux à partir de l'autre bord latéral de la partie de substrat (30) dans la direction circonférentielle dans la direction opposée à celle de la première partie de sertissage (31), et sertie de manière à entourer la circonférence externe du fil blindé (11); et une partie de restriction (46) disposée le long de la circonférence externe du fil blindé (11), la partie de restriction (46) amenant une première partie de mise en prise (34) de la première partie de sertissage (31) et une seconde partie de mise en prise (39) de la seconde partie de sertissage (36) à venir en prise l'une avec l'autre dans la direction circonférentielle dans des directions opposées l'une par rapport à l'autre.
(JA) 電線と圧着部との固着強度の向上を図る。 シールド電線(11)の接続構造を構成する圧着部(25)は、シールド電線(11)の外周に沿うように配された基板部(30)と、基板部(30)の一方の側縁部からシールド電線(11)の周方向へ片持ち状に延出し、シールド電線(11)の外周を包囲するようにカシメ付けられた第1カシメ部(31)と、基板部(30)の他方の側縁部から周方向において第1カシメ部(31)とは逆方向へ片持ち状に延出し、シールド電線(11)の外周を包囲するようにカシメ付けられた第2カシメ部(36)と、シールド電線(11)の外周に沿うように配され、第1カシメ部(31)の第1係止部(34)と第2カシメ部(36)の第2係止部(39)を周方向において互いに逆向きに係止させる規制部(46)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)