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1. (WO2019026557) CIRCUIT MODULE
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Pub. No.: WO/2019/026557 International Application No.: PCT/JP2018/025916
Publication Date: 07.02.2019 International Filing Date: 09.07.2018
IPC:
H01L 23/00 (2006.01) ,H01L 23/28 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
アルプスアルパイン株式会社 ALPS ALPINE CO., LTD. [JP/JP]; 東京都大田区雪谷大塚町1番7号 1-7, Yukigaya-otsukamachi, Ota-ku, Tokyo 1458501, JP
Inventors:
丸山 孝司 MARUYAMA, Takashi; JP
宮崎 正己 MIYAZAKI, Masami; JP
Agent:
野▲崎▼ 照夫 NOZAKI, Teruo; JP
Priority Data:
2017-14987602.08.2017JP
Title (EN) CIRCUIT MODULE
(FR) MODULE DE CIRCUIT
(JA) 回路モジュール
Abstract:
(EN) [Problem] To provide a circuit module allowing shielding properties to be raised without a concomitant increase in costs. [Solution] The invention comprises an electronic component 41 having a noise source 41a that generates a noise signal SG1 of a predetermined frequency, a circuit board 50 having a mounting surface 50a whereon the electronic component 41 has been mounted, and a seal resin layer 10 provided on the circuit board 50 in such a manner as to cover the electronic component 41. Provided in the seal resin layer 10 are two reflection surfaces R1 facing one another while sandwiching the noise source 41a. The two reflection surfaces R1 are provided in such a manner that the distance L1 from one another between the reflection surfaces R1 is an odd number multiple of 1/4 the wavelength λ of the noise signal SG1.
(FR) Le problème décrit par la présente invention est de garantir un module de circuit permettant d'améliorer des propriétés de blindage sans augmentation concomitante des coûts. La solution de l'invention comprend un composant électronique (41) disposant d'une source de bruit (41a) qui génère un signal de bruit SG1 d'une fréquence prédéterminée, une carte de circuit imprimé (50) présentant une surface de montage (50a) sur laquelle est monté le composant électronique (41), et une couche de résine d'étanchéité (10) disposée sur la carte de circuit (50) de manière à recouvrir le composant électronique (41). Deux surfaces de réflexion (R1) se faisant face sont disposées dans la couche de résine d'étanchéité (10) tout en prenant en sandwich la source de bruit (41a). Les deux surfaces de réflexion (R1) sont disposées de telle sorte que la distance L1 qui sépare ces dernières est un nombre impair multiple de 1/4 de la longueur d'onde λ du signal de bruit SG1.
(JA) 【課題】コストアップを伴わずに、シールド性を向上させることができる回路モジュールを提供する。 【解決手段】所定の周波数のノイズ信号SG1を発生させるノイズ源41aを有する電子部品41と、電子部品41が実装された実装面50aを有する回路基板50と、電子部品41を覆うように回路基板50に設けられた封止樹脂層10と、を備え、封止樹脂層10には、ノイズ源41aを挟んで互いに対向した2つの反射面R1が設けられていて、2つの反射面R1は、当該反射面R1間の互いの距離L1が、ノイズ信号SG1の波長λの1/4の奇数倍となるように設けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)