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1. (WO2019026508) METHOD FOR DIAGNOSING ROBOT
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Pub. No.: WO/2019/026508 International Application No.: PCT/JP2018/025039
Publication Date: 07.02.2019 International Filing Date: 02.07.2018
IPC:
H01L 21/677 (2006.01) ,B25J 9/10 (2006.01) ,B25J 9/22 (2006.01) ,H01L 21/68 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
9
Programme-controlled manipulators
10
characterised by positioning means for manipulator elements
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
9
Programme-controlled manipulators
16
Programme controls
22
Recording or playback systems
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
Applicants:
川崎重工業株式会社 KAWASAKI JUKOGYO KABUSHIKI KAISHA [JP/JP]; 兵庫県神戸市中央区東川崎町3丁目1番1号 1-1, Higashikawasaki-cho 3-chome, Chuo-ku, Kobe-shi, Hyogo 6508670, JP
カワサキロボティクス(アメリカ合衆国),インク. KAWASAKI ROBOTICS (USA), INC. [US/US]; ミシガン州ウィクソム レイクビュウドライブ 28140 28140, Lakeview Drive, Wixom, Michigan 48393, US
Inventors:
吉田 哲也 YOSHIDA, Tetsuya; --
ゼン, ミン ZENG, Ming; --
中原 一 NAKAHARA, Hajime; --
ロザノ, アントニオ ジョン LOZANO, Antonio John; --
在田 智一 ARITA, Tomokazu; --
Agent:
特許業務法人 有古特許事務所 PATENT CORPORATE BODY ARCO PATENT OFFICE; 兵庫県神戸市中央区東町123番地の1 貿易ビル3階 3rd Fl., Bo-eki Bldg., 123-1, Higashimachi, Chuo-ku, Kobe-shi, Hyogo 6500031, JP
Priority Data:
15/669,66504.08.2017US
Title (EN) METHOD FOR DIAGNOSING ROBOT
(FR) PROCÉDÉ DE DIAGNOSTIQUE DE ROBOT
(JA) ロボットの診断方法
Abstract:
(EN) A method for diagnosing a robot in order to detect the amount of displacement due to lost motion, wherein the method for diagnosing a robot is characterized by comprising: a first step for preparing a robot comprising a robot arm having at least one joint part, a workpiece conveyed by the robot, and a prealigner comprising a processing unit for detecting the center position of the workpiece; and, after the first to fifth steps have been performed, a sixth step for detecting the amount of displacement due to lost motion in the one joint part on the basis of the center position of the workpiece detected in the second step, the center position of the workpiece based on a command value from the robot control unit in the fourth step, and the center position of the workpiece detected in the fifth step.
(FR) L'invention concerne un procédé de diagnostic d'un robot afin de détecter la quantité de déplacement due à un mouvement perdu, le procédé de diagnostic d'un robot étant caractérisé en ce qu'il comprend: une première étape de préparation d'un robot comprenant un bras de robot ayant au moins une partie de joint, une pièce à travailler transportée par le robot, et un dispositif de pré-alignement comprenant une unité de traitement pour détecter la position centrale de la pièce à travailler; et, après que les première à cinquième étapes ont été effectuées, une sixième étape consistant à détecter la quantité de déplacement due à un mouvement perdu dans la première partie de joint sur la base de la position centrale de la pièce à travailler détectée dans la seconde étape, la position centrale de la pièce à travailler sur la base d'une valeur de commande provenant de l'unité de commande de robot dans la quatrième étape, et la position centrale de la pièce à travailler détectée dans la cinquième étape.
(JA) ロストモーションに起因したずれ量を検出するためのロボットの診断方法であって、少なくとも1つの関節部を有するロボットアームを備えるロボットと、前記ロボットにより搬送されるワークと、前記ワークの中心位置を検出する処理部を備えるプリアライナと、を準備する第1ステップと、前記第1乃至前記第5ステップを行った後で、前記第2ステップにおいて検出される前記ワークの中心位置、及び前記第4ステップにおける前記ロボット制御部からの指令値に基づいたワークの中心位置と、前記第5ステップにおいて検出されるワークの中心位置と、に基づいて前記1つの関節部におけるロストモーションに起因したずれ量を検出する第6ステップと、を備えることを特徴とする、ロボットの診断方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)