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1. (WO2019026474) SUBMOUNT, SEMICONDUCTOR LASER DEVICE, AND THERMALLY ASSISTED HARD DISK DEVICE
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Pub. No.: WO/2019/026474 International Application No.: PCT/JP2018/024074
Publication Date: 07.02.2019 International Filing Date: 26.06.2018
IPC:
G11B 5/31 (2006.01) ,G11B 5/02 (2006.01) ,H01L 21/301 (2006.01) ,H01S 5/022 (2006.01)
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
5
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
127
Structure or manufacture of heads, e.g. inductive
31
using thin film
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
5
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
02
Recording, reproducing or erasing methods; Read, write or erase circuits therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
井島 新一 IJIMA Shinichi; --
長野 一將 NAGANO Kazumasa; --
池戸 教夫 IKEDO Norio; --
Agent:
鎌田 健司 KAMATA Kenji; JP
前田 浩夫 MAEDA Hiroo; JP
Priority Data:
2017-15153304.08.2017JP
Title (EN) SUBMOUNT, SEMICONDUCTOR LASER DEVICE, AND THERMALLY ASSISTED HARD DISK DEVICE
(FR) EMBASE, DISPOSITIF LASER À SEMI-CONDUCTEUR ET DISPOSITIF À DISQUE DUR ASSISTÉ THERMIQUEMENT
(JA) サブマウント、半導体レーザ装置及び熱アシストハードディスク装置
Abstract:
(EN) A submount (100) comprises a substrate (110), the substrate (110) having: a first surface (101); a second surface (102) that is substantially perpendicular to the first surface (101); a third surface (103) that is substantially perpendicular to the first surface (101) and the second surface (102); a fourth surface (104) that is substantially perpendicular to the first surface (101) and the second surface (102), and faces the third surface (103); a fifth surface (105) that is substantially perpendicular to the second surface (102), the third surface (103), and the fourth surface (104), and faces the first surface (101); a sixth surface (106) that faces the second surface (102); a first notch part (113a) that is formed in a portion at which the second surface (102) and the third surface (103) are adjacent; and a second notch part (113b) that is formed in a portion at which the second surface (102) and the fourth surface (104) are adjacent, the first notch part (113a) and the second notch part (113b) each having a recessed surface that includes a curved surface.
(FR) L'invention concerne une embase (100) comprenant un substrat (110), le substrat (110) comportant : une première surface (101) ; une seconde surface (102) qui est sensiblement perpendiculaire à la première surface (101) ; une troisième surface (103) qui est sensiblement perpendiculaire à la première surface (101) et à la seconde surface (102 ) ; une quatrième surface (104) qui est sensiblement perpendiculaire à la première surface (101) et à la seconde surface (102), et fait face à la troisième surface (103) ; une cinquième surface (105) qui est sensiblement perpendiculaire à la seconde surface (102), la troisième surface (103), et la quatrième surface (104), et fait face à la première surface (101) ; une sixième surface (106) qui fait face à la seconde surface (102) ; une première partie d'encoche (113a) qui est formée dans une partie au niveau de laquelle la seconde surface (102) et la troisième surface (103) sont adjacentes ; et une seconde partie d'encoche (113b) qui est formée dans une partie au niveau de laquelle la seconde surface (102) et la quatrième surface (104) sont adjacentes, la première partie d'encoche (113a) et la seconde partie d'encoche (113b) comportant chacune une surface en retrait qui comprend une surface incurvée.
(JA) サブマウント(100)は、基板(110)を備え、基板(110)は、第1の面(101)と、第1の面(101)と略垂直な第2の面(102)と、第1の面(101)及び第2の面(102)と略垂直な第3の面(103)と、第1の面(101)及び第2の面(102)と略垂直であり、かつ、第3の面(103)と対向する第4の面(104)と、第2の面(102)、第3の面(103)及び第4の面(104)と略垂直であり、かつ、第1の面(101)と対向する第5の面(105)と、第2の面(102)と対向する第6の面(106)と、第2の面(102)と第3の面(103)とが隣接する部分に形成された第1の切り欠け部(113a)と、第2の面(102)と第4の面(104)とが隣接する部分に形成された第2の切り欠け部(113b)とを有し、第1の切り欠け部(113a)及び第2の切り欠け部(113b)は、各々、曲面を含む凹面を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)