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1. (WO2019026458) SILOXANE RESIN COMPOSITION, ADHESIVE USING SAME, DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND ILLUMINATION DEVICE
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Pub. No.: WO/2019/026458 International Application No.: PCT/JP2018/023623
Publication Date: 07.02.2019 International Filing Date: 21.06.2018
IPC:
C08L 83/07 (2006.01) ,C08G 77/20 (2006.01) ,C08L 83/04 (2006.01) ,C09J 4/00 (2006.01) ,C09J 183/04 (2006.01) ,C09J 183/07 (2006.01) ,H01L 21/52 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
20
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
飯塚英祐 IIZUKA, Eisuke; JP
山口美智子 YAMAGUCHI, Michiko; JP
諏訪充史 SUWA, Mitsuhito; JP
鴨川政雄 KAMOGAWA, Masao; JP
Priority Data:
2017-14987802.08.2017JP
Title (EN) SILOXANE RESIN COMPOSITION, ADHESIVE USING SAME, DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND ILLUMINATION DEVICE
(FR) COMPOSITION DE RÉSINE SILOXANE, ADHÉSIF L'UTILISANT, DISPOSITIF D'AFFICHAGE, DISPOSITIF À SEMI-CONDUCTEURS ET DISPOSITIF D'ÉCLAIRAGE
(JA) シロキサン樹脂組成物、それを用いた接着剤、表示装置、半導体装置および照明装置
Abstract:
(EN) Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. A siloxane resin composition containing: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D). (In general formulas (1) through (3): R1, R2, and R3 each independently represent a hydrogen atom, a hydroxy group, a group having a siloxane bond, or a C1-30 univalent organic group; X represents an alkenyl group, an alkynyl group, a univalent organic group having a nitrogen atom and a carbon-oxygen unsaturated bond, or a univalent organic group having a cyclic ether bond; Y represents a univalent organic group having a photo-radical polymerizable group (excluding alkenyl groups and alkynyl groups); Z represents a univalent organic group having an alkali-soluble group; a, b, and c each independently represent an integer of 1 or greater; and when a through c are 2 or greater, a plurality of R1, R2, R3, X, Y, and Z may each be the same or different.)
(FR) L'invention concerne une composition de résine siloxane ayant d'excellentes propriétés d'adhérence et de formation de motifs fins. La composition de résine siloxane selon l'invention contient : une résine siloxane (A) contenant une structure représentée par la formule générale (1), une structure représentée par la formule générale (2), et une structure représentée par la formule générale (3) ; un composé (B) contenant une double liaison insaturée ; un initiateur de photopolymérisation (C) ; et un solvant (D). (Dans les formules générales (1) à (3) : R1, R2, et R3 représentent chacun indépendamment un atome d'hydrogène, un groupe hydroxy, un groupe contenant une liaison siloxane, ou un groupe organique univalent en C1-30 ; X représente un groupe alcényle, un groupe alcynyle, un groupe organique univalent contenant un atome d'azote et une liaison insaturée carbone-oxygène, ou un groupe organique univalent contenant une liaison éther cyclique ; Y représente un groupe organique univalent contenant un groupe polymérisable par voie photoradicalaire (à l'exclusion des groupes alcényle et des groupes alcynyle) ; Z représente un groupe organique univalent contenant un groupe soluble dans un alcali ; a, b et c représentent chacun indépendamment un nombre entier de 1 ou plus ; et quand a à c sont 2 ou plus, une pluralité de R1, R2, R3, et Z peuvent être identiques ou différents).
(JA) 接着性および微細パターン加工性に優れるシロキサン樹脂組成物を提供する。下記一般式(1)で表される構造、下記一般式(2)で表される構造および下記一般式(3)で表される構造を含むシロキサン樹脂(A)、不飽和二重結合を有する化合物(B)、光重合開始剤(C)および溶剤(D)を含有するシロキサン樹脂組成物である。 (一般式(1)~(3)中、R、RおよびRはそれぞれ独立に水素、ヒドロキシ基、シロキサン結合を有する基または炭素数1~30の1価の有機基を表す。Xはアルケニル基、アルキニル基、窒素原子と炭素-酸素不飽和結合とを有する1価の有機基または環式エーテル結合を有する1価の有機基を表す。Yは光ラジカル重合性基(ただし、アルケニル基およびアルキニル基を除く)を有する1価の有機基を表す。Zはアルカリ可溶性基を有する1価の有機基を表す。a、bおよびcはそれぞれ独立に1以上の整数を表す。a~cが2以上の場合、複数のR、R、R、X、YおよびZはそれぞれ同じであっても異なっていてもよい。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)