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1. (WO2019026319) ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
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Pub. No.: WO/2019/026319 International Application No.: PCT/JP2018/005489
Publication Date: 07.02.2019 International Filing Date: 16.02.2018
IPC:
H05K 3/32 (2006.01) ,H05K 3/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
オムロン株式会社 OMRON CORPORATION [JP/JP]; 京都府京都市下京区塩小路通堀川東入南不動堂町801番地 801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogyo-ku, Kyoto-shi, Kyoto 6008530, JP
Inventors:
川井 若浩 KAWAI, Wakahiro; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2017-14995002.08.2017JP
Title (EN) ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
(FR) DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 電子装置およびその製造方法
Abstract:
(EN) This electronic device is provided with: a resin molding (10); and a conductive cable (31b) including an electric wire (32b). One end portion (35b) of the conductive cable (31b) is embedded in the resin molding (10). The surface of the resin molding (10) exposes an end surface (34b) on the side of the one end portion (35b) of the conductive cable (31b) and includes a surface (11) which is continuous to the end surface (34b). The electronic device is further provided with wires (40f, 40i) formed on the end surface (34b) and the surface (11) so as to be connected to the electric wire (32b) in the end surface (34b).
(FR) La présente invention concerne un dispositif électronique pourvu : d'un moulage en résine (10) ; et d'un câble conducteur (31b) comprenant un fil électrique (32b). Une partie d'extrémité (35b) du câble conducteur (31b) est incorporée dans le moulage en résine (10). La surface du moulage en résine (10) expose une surface d'extrémité (34b) sur le côté de la partie d'extrémité (35b) du câble conducteur (31b) et comprend une surface (11) qui est contigüe à la surface d'extrémité (34b). Le dispositif électronique est en outre pourvu de fils (40f, 40i) formés sur la surface d'extrémité (34b) et sur la surface (11) à des fins de connexion au fil électrique (32b) dans la surface d'extrémité (34b).
(JA) 電子装置は、樹脂成形体(10)と、電線(32b)を含む導電ケーブル(31b)とを備える。導電ケーブル(31b)の一方端部(35b)は樹脂成形体(10)に埋設される。樹脂成形体(10)の表面は、導電ケーブル(31b)における一方端部(35b)側の端面(34b)を露出させるとともに、端面(34b)に連続する面(11)を含む。電子装置は、端面(34b)内の電線(32b)に接続するように、端面(34b)および面(11)上に形成される配線(40f,40i)をさらに備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)