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1. (WO2019025970) COPPER INK
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Pub. No.: WO/2019/025970 International Application No.: PCT/IB2018/055727
Publication Date: 07.02.2019 International Filing Date: 31.07.2018
IPC:
C09D 11/52 (2014.01) ,H01B 1/12 (2006.01) ,H01B 5/14 (2006.01) ,H05K 3/12 (2006.01)
[IPC code unknown for C09D 11/52]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
06
mainly consisting of other non-metallic substances
12
organic substances
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
Applicants:
NATIONAL RESEARCH COUNCIL OF CANADA [CA/CA]; 1200 Montreal Road Ottawa, Ontario K1A 0R6, CA
Inventors:
DEORE, Bhavana; CA
PAQUET, Chantal; CA
MALENFANT, Patrick; CA
Agent:
LEMAY, Catherine; CA
DAVIS, Jason E.J.; CA
SMITH, Jessica; CA
THOMAS, Roula; CA
PATENAUDE, Sonia; CA
MURPHY, Kenneth; CA
Priority Data:
62/539,61001.08.2017US
Title (EN) COPPER INK
(FR) ENCRE DE CUIVRE
Abstract:
(EN) A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.
(FR) L'invention concerne une encre à base de cuivre qui contient de l'hydroxyde de cuivre et de la diéthanolamine. L'encre peut être appliquée sur un substrat et décomposée sur le substrat pour former un revêtement de cuivre conducteur sur le substrat. L'encre est peu coûteuse et des traces d'épaisseur micrométrique de l'encre peuvent être imprimées par sérigraphie et frittées thermiquement en présence d'une quantité allant jusqu'à environ 500 ppm d'oxygène ou photo-frittées dans l'air pour produire des éléments de cuivre hautement conducteurs. Les traces de cuivre frittées produites à partir de l'encre ont une stabilité à l'air améliorée par rapport aux traces produites à partir d'autres encres de cuivre. Des traces de cuivre frittées ayant une résistivité de la feuille d'environ 20 mΩ/□/mil ou moins peuvent être obtenues pour des lignes imprimées par sérigraphie ayant une largeur de 5 à 20 mils avec une excellente résolution.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)