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1. (WO2019025209) OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
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Pub. No.: WO/2019/025209 International Application No.: PCT/EP2018/069759
Publication Date: 07.02.2019 International Filing Date: 20.07.2018
IPC:
H01L 33/60 (2010.01) ,H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
60
Reflective elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
TÅNGRING, Ivar; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2017 117 536.902.08.2017DE
Title (EN) OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
(FR) COMPOSANT OPTOÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION D’UN COMPOSANT OPTOÉLECTRONIQUE
(DE) OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES OPTOELEKTRONISCHEN BAUELEMENTS
Abstract:
(EN) The invention relates to an optoelectronic component (100) comprising a semiconductor chip (1) configured for emitting radiation, a reflection element (2) arranged in the beam path of the semiconductor chip and provided for reflecting radiation, wherein the reflection element (2) comprises a matrix material (21) and, embedded therein, diffusor particles (22) and filling particles (23), wherein the diffusor particles (22) and the filling particles (23) differ from one another, wherein the filling particles (23) comprise a matrix (231), into which scattering particles (232) are embedded, and/or a ceramic (234), in which the scattering particles are present in sintered form.
(FR) L'invention concerne un composant optoélectronique (100) comprenant une puce semiconductrice (1) qui est conçue pour émettre un rayonnement, un élément de réflexion (2) qui est disposé dans le trajet du faisceau de la puce semiconductrice et qui est prévu pour réfléchir le rayonnement, l'élément de réflexion (2) présentant un matériau de matrice (21) et des particules de diffusion (22) et des particules de charge (23) incorporées dans celui-ci. Les particules de diffusion (22) se différencient des particules de charge (23), les particules de charge (23) présentant une matrice (231) dans laquelle sont incorporées des particules de dispersion (232), et/ou une céramique (234) dans laquelle les particules de dispersion sont présentes sous forme frittée.
(DE) Die Erfindung betrifft ein optoelektronisches Bauelement (100) aufweisend einen Halbleiterchip (1), der zur Emission von Strahlung eingerichtet ist, ein Reflexionselement (2), das im Strahlengang des Halbleiterchips angeordnet ist und zur Strahlungsreflexion vorgesehen ist, wobei das Reflexionselement (2) ein Matrixmaterial (21) und darin eingebettet Diffusorpartikel (22) und Füllpartikel (23) aufweist, wobei die Diffusorpartikel (22) und die Füllpartikel (23) sich voneinander unterscheiden, wobei die Füllpartikel (23) eine Matrix (231), in die Streupartikel (232) eingebettet sind, und/oder eine Keramik (234), in der die Streupartikel gesintert vorliegen, aufweisen.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)