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1. (WO2019025142) A DEVICE MANUFACTURING METHOD AND A COMPUTER PROGRAM PRODUCT
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Pub. No.: WO/2019/025142 International Application No.: PCT/EP2018/068751
Publication Date: 07.02.2019 International Filing Date: 11.07.2018
IPC:
G03F 7/20 (2006.01) ,B24B 37/005 (2012.01) ,G01N 21/47 (2006.01) ,G01N 21/84 (2006.01) ,H01L 21/67 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
[IPC code unknown for B24B 37/05]
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
17
Systems in which incident light is modified in accordance with the properties of the material investigated
47
Scattering, i.e. diffuse reflection
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
ASML NETHERLANDS B.V. [NL/NL]; P.O. Box 324 5500 AH Veldhoven, NL
Inventors:
CALADO, Victor, Emanuel; NL
VAN HAREN, Richard, Johannes, Franciscus; NL
DEPRE, Jerome, Yann, Remi; NL
MASSACRIER, Clément, André, Auguste; NL
Agent:
PETERS, John; NL
Priority Data:
17184435.002.08.2017EP
Title (EN) A DEVICE MANUFACTURING METHOD AND A COMPUTER PROGRAM PRODUCT
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF ET PRODUIT DE PROGRAMME INFORMATIQUE
Abstract:
(EN) A device manufacturing method comprising: forming a layer on a substrate by a layer-forming process; determining a value of a metric at a plurality of positions across the substrate, wherein variation of the values across the substrate is indicative of variation of layer thickness across the substrate; controlling the layer-forming parameter based on the values so as to reduce variation of layer thickness in a subsequent layer-forming process on a different substrate; and repeating the layer- forming process on a different substrate according to the controlled layer-forming parameter.
(FR) L'invention concerne un procédé de fabrication de dispositif qui comprend : la formation d'une couche sur un substrat par un processus de formation de couche ; la détermination d'une valeur d'une mesure prise à une pluralité de positions sur le substrat, la variation des valeurs prises sur le substrat étant indicative d'une variation d'épaisseur de couche sur le substrat ; la commande du paramètre de formation de couche sur la base des valeurs obtenues de façon à réduire la variation d'épaisseur de couche dans un processus de formation de couche subséquent sur un substrat différent ; et la répétition du processus de formation de couche sur un substrat différent selon le paramètre de formation de couche commandé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)