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1. (WO2019025009) METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE
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Claims

1. A method for producing an optoelectronic semiconductor device (10) comprising the following steps:

- providing a frame part (1) which comprises a plurality of openings (11),

- providing an auxiliary carrier (2),

- connecting the auxiliary carrier (2) to the frame part (1) such that the auxiliary carrier (2) covers at least some of the openings (11) at an underside (la) of the frame part (1),

- placing conversion elements (3) onto the auxiliary carrier (2) in at least some of the openings (11),

- placing optoelectronic semiconductor chips (4) onto the conversion elements (3) in at least some of the openings (11),

- applying a housing (5) onto the conversion elements (3) and around the semiconductor chips (4) in at least some of the openings (11),

- removing the frame part (1) and the auxiliary carrier (2) .

2. The method according to the previous claim, wherein the auxiliary carrier (2) comprises an adhesive tape which has heat-releasing properties.

3. The method according to at least one of the previous claims, wherein

the frame part (1) is a waffle pack.

4. The method according to at least one of the previous claims, wherein

at least one of the conversion elements (3) comprises a B-stage silicone base material.

5. The method according to at least one of the previous claims, wherein

the housing is applied by compression molding.

6. The method according to at least one of the previous claims, wherein

the housing comprises particles of T1O2 and S1O2 in a silicone base material.

7. The method according to at least one of the previous claims, wherein

the combined thickness of one of the conversion elements (3) and one of the optoelectronic semiconductor chips (4) placed on said conversion element (3) is at least the thickness of the frame part.

8. The method according to at least one of the previous claims, wherein

the at least some of the optoelectronic semiconductor chips (4) comprise contact locations (41, 42) for electrically contacting the semiconductor chips (4) which are arranged at a bottom surface (43) facing away from the conversion element .

9. The method according to at least one of the previous claims, wherein

the bottom surface (43) of at least some of the

optoelectronic semiconductor chips (4) remains free of the housing (5) .