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1. (WO2019024974) COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME
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Pub. No.: WO/2019/024974 International Application No.: PCT/EP2017/069316
Publication Date: 07.02.2019 International Filing Date: 31.07.2017
IPC:
H05K 3/38 (2006.01) ,H05K 3/02 (2006.01) ,H05K 1/03 (2006.01) ,C08L 71/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71
Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08
Polyethers derived from hydroxy compounds or from their metallic derivatives
10
from phenols
12
Polyphenylene oxides
Applicants:
CIRCUIT FOIL LUXEMBOURG, SÀRL [LU/LU]; 6, Salzbaach 9559 Wiltz, LU
Inventors:
DEVAHIF, Thomas; LU
STREEL, Michel; NL
KAIDI, Zainhia; LU
Agent:
ISARPATENT - PATENT- UND RECHTSANWÄLTE BEHNISCH BARTH CHARLES HASSA PECKMANN UND PARTNER MBB; Friedrichstraße 31 80801 München, DE
Priority Data:
Title (EN) COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME
(FR) STRATIFIÉ CUIVRÉ ET CARTE DE CIRCUIT IMPRIMÉ COMPRENANT CE DERNIER
Abstract:
(EN) The present invention is a copper-clad laminate comprising at least one of a copper layer having a roughened surface which is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 μm to 70 μm and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6N/mm when the thickness of the copper layer is more than Sum, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer. The copper-clad laminate provided in the present invention has advantages in that, by controlling a thickness and surface roughness of a copper layer included therein, adhesion strength with a resin layer laminated on the copper layer is very high, and electrical properties are excellent as well due to a low insertion loss.
(FR) La présente invention concerne un stratifié cuivré comprenant au moins une couche de cuivre présentant une surface rugueuse obtenue par rugosification d'au moins une surface d'une couche de cuivre de base de manière à avoir un profil bas comprenant une couche de cuivre d'une épaisseur de 5 µm à 70 µm et une couche de résine sur la couche de cuivre, une force de pelage entre la couche de cuivre et la couche de résine étant supérieure à 0,6 N/mm quand l'épaisseur de la couche de cuivre est supérieure à la somme, et une rugosité moyenne en dix points Sz de la surface rugueuse étant inférieure à celle de la couche de cuivre de base. Le stratifié cuivré de l'invention présente les avantages d'une force d'adhérence très élevée à une couche de résine stratifiée sur une couche de cuivre, par régulation de l'épaisseur et de la rugosité de surface de la couche de cuivre comprise dans ce dernier, et dispose d'excellentes propriétés électriques en raison d'une faible perte d'insertion.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)