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1. (WO2019024973) SURFACE TREATED COPPER FOIL AND COPPER-CLAD LAMINATE
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Pub. No.: WO/2019/024973 International Application No.: PCT/EP2017/069315
Publication Date: 07.02.2019 International Filing Date: 31.07.2017
IPC:
H05K 3/38 (2006.01) ,H05K 1/09 (2006.01) ,C25D 3/38 (2006.01) ,C25D 5/16 (2006.01) ,C25D 1/04 (2006.01) ,H05K 3/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
38
of copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
16
Electroplating with layers of varying thickness
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
04
Wires; Strips; Foils
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Applicants:
CIRCUIT FOIL LUXEMBOURG, SÀRL [LU/LU]; 6, Salzbaach 9559 Wiltz, LU
Inventors:
DEVAHIF, Thomas; LU
STREEL, Michel; LU
KAIDI, Zainhia; LU
Agent:
ISARPATENT - PATENT- UND RECHTSANWÄLTE BEHNISCH BARTH CHARLES HASSA PECKMANN UND PARTNER MBB; Friedrichstraße 31 80801 München, DE
Priority Data:
Title (EN) SURFACE TREATED COPPER FOIL AND COPPER-CLAD LAMINATE
(FR) FEUILLE DE CUIVRE TRAITÉE EN SURFACE ET STRATIFIÉ CUIVRÉ
Abstract:
(EN) Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 μηι to 70 μιτι, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 μηι to 2.0 μιτι, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.
(FR) La présente invention concerne une feuille de cuivre ayant une propriété de faible rugosité par rugosification d'un côté mat, une épaisseur de la feuille de cuivre étant comprise entre 5 μm et 70 μm, et la rugosité moyenne mesurée par profilomètre de la surface rugueuse de la feuille de cuivre étant comprise entre 0,5 μm et 2,0 μm, et la rugosité moyenne mesurée par profilomètre Rz JIS du côté mat rugueux de la feuille de cuivre étant inférieure à celle d'un côté brillant de la feuille de cuivre. La feuille de cuivre selon l'invention présente une excellente adhérence avec une résine et une propriété électrique tout en ayant une faible rugosité par rugosification de surface.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)