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1. (WO2019024965) SENSOR CHIP FOR A MOTOR VEHICLE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/024965 International Application No.: PCT/DE2018/200072
Publication Date: 07.02.2019 International Filing Date: 02.08.2018
IPC:
G01S 7/481 (2006.01) ,G01S 7/486 (2006.01) ,G01S 7/491 (2006.01) ,G01S 17/89 (2006.01) ,H01L 27/146 (2006.01) ,G01S 17/93 (2006.01)
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7
Details of systems according to groups G01S13/, G01S15/, G01S17/127
48
of systems according to group G01S17/58
481
Constructional features, e.g. arrangements of optical elements
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7
Details of systems according to groups G01S13/, G01S15/, G01S17/127
48
of systems according to group G01S17/58
483
Details of pulse systems
486
Receivers
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7
Details of systems according to groups G01S13/, G01S15/, G01S17/127
48
of systems according to group G01S17/58
491
Details of non-pulse systems
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
17
Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
88
Lidar systems, specially adapted for specific applications
89
for mapping or imaging
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
17
Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
88
Lidar systems, specially adapted for specific applications
93
for anti-collision purposes
Applicants:
CONTI TEMIC MICROELECTRONIC GMBH [DE/DE]; Sieboldstraße 19 90411 Nürnberg, DE
CONTINENTAL AUTOMOTIVE GMBH [DE/DE]; Vahrenwalder Straße 9 30165 Hannover, DE
Inventors:
FEY, Wolfgang; DE
MEHR, Wilfried; AT
MAIER, Theodor; DE
Common
Representative:
CONTI TEMIC MICROELECTRONIC GMBH; Intellectual Property Sieboldstraße 19 90411 Nuernberg, DE
Priority Data:
10 2017 213 480.103.08.2017DE
Title (EN) SENSOR CHIP FOR A MOTOR VEHICLE
(FR) SENSOR CHIP POUR VÉHICULE À MOTEUR
(DE) SENSOR-CHIP FÜR EIN KRAFTFAHRZEUG
Abstract:
(EN) The invention relates to a sensor chip for a motor vehicle, said sensor chip being in the form of a monolithic semiconductor substrate and comprising: a detector array unit (10) configured to convert electromagnetic radiation into a sensor signal; and a reading circuit unit (20) configured to process the signal supplied by the detector array unit and convert same into an electric output signal.
(FR) L'invention concerne une sensor chip pour véhicule à moteur, la sensor chip étant conçue comme un substrat semiconducteur monolithique la sensor chip comprenant : un dispositif formant matrice de capteurs (10) conçu pour convertir un rayonnement électromagnétique en un signal de capteur ; et un dispositif formant circuit de lecture (20) conçu pour préparer le signal de capteur fourni par le dispositif formant matrice de capteurs et le convertir en un signal de sortie électrique.
(DE) Die Erfindung betrifft einen Sensor-Chip für ein Kraftfahrzeug, wobei der Sensor-Chip als ein monolithisches Halbleiter-Substrat ausgebildet ist und der Sensor-Chip umfasst: eine Detektorfeldeinrichtung (10), welche dazu ausgelegt ist, elektromagnetische Strahlung in ein Sensorsignal zu wandeln; und eine Ausleseschaltungseinrichtung (20), welche dazu ausgelegt ist, das von der Detektorfeldeinrichtung bereitgestellte Sensorsignal aufzubereiten und in ein elektrisches Ausgangssignal zu wandeln.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)