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1. (WO2019024626) FLEXIBLE SUBSTRATE, AND PROCESSING METHOD AND PROCESSING SYSTEM THEREFOR
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Pub. No.: WO/2019/024626 International Application No.: PCT/CN2018/093094
Publication Date: 07.02.2019 International Filing Date: 27.06.2018
IPC:
G09F 9/30 (2006.01)
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国四川省成都市 高新区(西区)合作路1188号 No.1188 Hezuo Rd., (West Zone), Hi-tech Development Zone Chengdu, Sichuan 611731, CN
Inventors:
黄炜赟 HUANG, Weiyun; CN
承天一 CHENG, Tianyi; CN
Agent:
北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES; 中国北京市 海淀区彩和坊路10号1号楼10层 10th Floor, Building 1 10 Caihefang Road, Haidian District Beijing 100080, CN
Priority Data:
201710660238.004.08.2017CN
Title (EN) FLEXIBLE SUBSTRATE, AND PROCESSING METHOD AND PROCESSING SYSTEM THEREFOR
(FR) SUBSTRAT SOUPLE, PROCÉDÉ DE TRAITEMENT ET SYSTÈME DE TRAITEMENT ASSOCIÉS
(ZH) 柔性基板及其加工方法、加工系统
Abstract:
(EN) A flexible substrate, and a processing method and processing system therefor. The processing method for the flexible substrate comprises: measuring a first expansion amount of a flexible substrate (20); applying a first applied pressure to the flexible substrate (20) so as to laminate the flexible substrate (20) on a base substrate (50), wherein the first applied pressure is selected according to a first corresponding relationship between a first pressure applied to the flexible substrate (20) and a compression expansion amount generated by compressing the flexible substrate (20) and according to the first expansion amount, so that a second expansion amount of the flexible substrate (20) may at least partially compensate for the first expansion amount. The described processing method for the flexible substrate may reduce the expansion amount of the flexible substrate and reduce the difference in expansion amount of flexible substrates during mass production, so as to better carry out subsequent production processes such as a bonding process.
(FR) L'invention concerne un substrat souple, ainsi qu'un procédé de traitement et un système de traitement associés. Le procédé de traitement du substrat souple comprend : la mesure d'un premier volume d'expansion d'un substrat souple (20) ; l'application d'une première pression appliquée au substrat souple (20) de façon à stratifier le substrat souple (20) sur un substrat de base (50), la première pression appliquée étant sélectionnée selon une première relation correspondante entre une première pression appliquée au substrat souple (20) et une quantité d'expansion de compression générée par compression du substrat souple (20) et selon la première quantité d'expansion, de telle sorte qu'un deuxième volume d'expansion du substrat souple (20) peut au moins partiellement compenser le premier volume d'expansion. Le procédé de traitement décrit pour le substrat souple peut réduire le volume d'expansion du substrat souple et réduire la différence de volume d'expansion de substrats souples pendant la production de masse, de façon à mieux réaliser des processus de production ultérieurs tels qu'un processus de liaison.
(ZH) 一种柔性基板及其加工方法、加工系统。该柔性基板的加工方法包括:测量柔性基板(20)的第一膨胀量;对柔性基板(20)施加第一施加压力以将柔性基板(20)层叠在衬底基板(50)上,其中,根据对柔性基板(20)施加的第一压力与柔性基板(20)受压而产生的受压膨胀量之间的第一对应关系以及第一膨胀量,选择第一施加压力,使得柔性基板(20)的第二膨胀量可至少部分补偿第一膨胀量。该柔性基板的加工方法可以减小柔性基板的膨胀量并在大批量生产时缩小各柔性基板的膨胀量差异,从而更好的进行后续的接合工艺等生产工序。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)