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1. (WO2019024569) PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE
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Pub. No.: WO/2019/024569 International Application No.: PCT/CN2018/087129
Publication Date: 07.02.2019 International Filing Date: 16.05.2018
IPC:
H01L 51/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国四川省成都市 高新区(西区)合作路1188号 No.1188, Hezuo Rd., (West Zone), Hi-tech Development Zone Chengdu, Sichuan 611731, CN
Inventors:
葛林 GE, Lin; CN
Agent:
北京天昊联合知识产权代理有限公司 TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS; 中国北京市 东城区建国门内大街28号民生金融中心D座10层陈源 CHEN, Yuan 10th Floor, Tower D, Minsheng Financial Center, 28 Jianguomennei Avenue, Dongcheng District Beijing 100005, CN
Priority Data:
201710646937.X01.08.2017CN
Title (EN) PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE
(FR) STRUCTURE D'ENCAPSULATION ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D'AFFICHAGE
(ZH) 封装结构及其制备方法和显示装置
Abstract:
(EN) Provided by the present disclosure are a package structure and a fabrication method therefor, and a display device. The package structure comprises a substrate, an organic electroluminescent component that is disposed on the substrate, and an encapsulation film layer that is disposed on the organic electroluminescent component, the encapsulation film layer encapsulating the organic electroluminescent component on the substrate; an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
(FR) La présente invention concerne une structure d'encapsulation et son procédé de fabrication, ainsi qu'un appareil d'affichage. La structure d'encapsulation comprend un substrat, un composant électroluminescent organique qui est disposé sur le substrat, et une couche de film d'encapsulation qui est disposée sur le composant électroluminescent organique, la couche de film d'encapsulation encapsulant le composant électroluminescent organique sur le substrat ; une structure d'adsorption est formée dans la couche de film d'encapsulation, et la structure d'adsorption est configurée pour absorber l'humidité et l'oxygène.
(ZH) 本公开提供一种封装结构及其制备方法和显示装置。该封装结构包括基底、设置在基底上的有机电致发光器件以及设置在所述有机电致发光器件上的封装膜层,所述封装膜层将所述有机电致发光器件封装在所述基底上;其中,所述封装膜层中形成有吸附结构,所述吸附结构配置为吸收水汽和氧气。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)