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1. (WO2019024253) THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME
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Pub. No.: WO/2019/024253 International Application No.: PCT/CN2017/106827
Publication Date: 07.02.2019 International Filing Date: 19.10.2017
IPC:
C08L 25/08 (2006.01) ,C08J 5/24 (2006.01) ,B32B 27/04 (2006.01) ,B32B 15/08 (2006.01) ,H05K 1/05 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02
Homopolymers or copolymers of hydrocarbons
04
Homopolymers or copolymers of styrene
08
Copolymers of styrene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
04
as impregnant, bonding, or embedding substance
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
05
Insulated metal substrate
Applicants:
广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO.,LTD. [CN/CN]; 中国广东省东莞市 松山湖高新技术产业开发区工业西路5号 NO.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development Zone Dongguan City, Guangdong 523808, CN
Inventors:
关迟记 GUAN, Chiji; CN
曾宪平 ZENG, Xianping; CN
陈广兵 CHEN, Guangbing; CN
徐浩晟 XU, Haosheng; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201710661518.304.08.2017CN
Title (EN) THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE ET PRÉ-IMPRÉGNÉ ET STRATIFIÉ RECOUVERTS DE FEUILLE MÉTALLIQUE FABRIQUÉ AU MOYEN DE LADITE COMPOSITION
(ZH) 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板
Abstract:
(EN) A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a polyfunctional vinyl aromatic copolymer having a structural unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.
(FR) L'invention concerne une composition de résine thermodurcissable et un pré-imprégné et un stratifié recouverts de feuille métallique fabriqués au moyen de celle-ci, la composition de résine thermodurcissable comprenant le composant (A): un copolymère aromatique vinylique polyfonctionnel soluble dans un solvant, le copolymère étant un copolymère aromatique de vinyle polyfonctionnel ayant une unité structurelle dérivée de monomères comportant un composé aromatique divinylique (a) et un composé vinylique aromatique d'éthyle (b); et le composant (B) : une résine de silicone organique contenant du vinyle. Le pré-imprégné et le stratifié recouverts de feuille métallique fabriqués à partir de la composition de résine thermodurcissable ont une bonne ténacité, et maintiennent une température de transition vitreuse élevée, une faible absorption d'eau, des propriétés diélectriques et une résistance à l'humidité, étant appropriés pour le domaine des cartes de circuits imprimés à haute fréquence et à grande vitesse et le traitement de cartes de circuits imprimés multicouches.
(ZH) 热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板,所述热固性树脂组合物包括(A)成分:溶剂可溶性的多官能乙烯基芳香族共聚物,该共聚物是具有来自于包括二乙烯基芳香族化合物(a)及乙基乙烯基芳香族化合物(b)的单体的结构单元的多官能乙烯基芳香族共聚物;和(B)成分:含有乙烯基的有机硅树脂。由所述热固性树脂组合物制作的半固化片及覆铜箔层压板具有良好的韧性,且保持了高的玻璃化转变温度、低的吸水率、介电特性和耐湿热性,适合高频高速印制线路板领域使用,并适合于多层印制线路板加工。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)