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1. (WO2019024047) SOLDER PREFORM AND METHOD OF MANUFACTURING THE SAME WELDING METHOD, WELDING APPARATUS AND ELECTRONIC DEVICE
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Pub. No.: WO/2019/024047 International Application No.: PCT/CN2017/095830
Publication Date: 07.02.2019 International Filing Date: 03.08.2017
IPC:
H05K 3/34 (2006.01) ,H01L 23/488 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
Applicants:
DUAN, Pinghua [CN/CN]; CN (SC)
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) [SE/SE]; SE-164 83 Stockholm, SE
Inventors:
DUAN, Pinghua; CN
DOU, Jinhui; CN
YING, Zhan; CN
Agent:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD.; 16th Fl., Block A, Corporate Square No. 35 Jinrong Street Beijing 100033, CN
Priority Data:
Title (EN) SOLDER PREFORM AND METHOD OF MANUFACTURING THE SAME WELDING METHOD, WELDING APPARATUS AND ELECTRONIC DEVICE
(FR) COMPRIMÉ DE BRASURE ET SON PROCÉDÉ DE FABRICATION, APPAREIL DE SOUDAGE ET DISPOSITIF ÉLECTRONIQUE
Abstract:
(EN) A solder preform and a method of manufacturing the same, a welding method, a welding apparatus and an electronic device. The solder preform includes: at least one layer of fabric structure; wherein, in each layer of the fabric structure, there are multiple wicking holes constituted by multiple adjacent woven nodes, the multiple wicking holes being used for sorbing liquid phase solder.
(FR) Cette invention concerne un comprimé de brasure et son procédé de fabrication, un procédé de soudage, un appareil de soudage et un dispositif électronique. Le comprimé de brasure comprend au moins une couche de structure de tissu. Dans chaque couche de la structure de tissu, plusieurs trous de pénétration capillaire sont formés par de multiples nœuds tissés adjacents, les multiples trous de pénétration capillaire étant utilisés pour la sorption de brasure en phase liquide.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)