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1. (WO2019022039) METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/022039 International Application No.: PCT/JP2018/027602
Publication Date: 31.01.2019 International Filing Date: 24.07.2018
IPC:
C23C 26/00 (2006.01) ,C09D 11/037 (2014.01) ,C09D 11/52 (2014.01) ,H01B 13/00 (2006.01) ,H05K 3/12 (2006.01) ,C22C 5/08 (2006.01) ,C22C 9/00 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
26
Coating not provided for in groups C23C2/-C23C24/87
[IPC code unknown for C09D 11/037][IPC code unknown for C09D 11/52]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
5
Alloys based on noble metals
06
Alloys based on silver
08
with copper as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
Applicants:
千住金属工業株式会社 SENJU METAL INDUSTRY CO., LTD. [JP/JP]; 東京都足立区千住橋戸町23番地 23, Senju-Hashido-cho, Adachi-ku, Tokyo 1208555, JP
国立大学法人大阪大学 OSAKA UNIVERSITY [JP/JP]; 大阪府吹田市山田丘1番1号 1-1, Yamadaoka. Suita-shi, Osaka 5650871, JP
Inventors:
酒 金亭 JIU Jinting; JP
上島 稔 UESHIMA Minoru; JP
菅沼 克昭 SUGANUMA Katsuaki; JP
李 万里 LI Wanli; JP
Agent:
剱物 英貴 KENMOTSU Hidetaka; JP
Priority Data:
2017-14403825.07.2017JP
Title (EN) METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART
(FR) PROCÉDÉ DE SYNTHÈSE D'UN ALLIAGE DE CUIVRE-ARGENT, PROCÉDÉ DE FORMATION D'UNE PARTIE CONDUCTRICE, ALLIAGE DE CUIVRE-ARGENT ET PARTIE CONDUCTRICE
(JA) 銅銀合金の合成方法、導通部の形成方法、銅銀合金、および導通部
Abstract:
(EN) Provided are a method for synthesizing a copper-silver alloy, whereby a copper-silver alloy can easily be synthesized at low temperature and in a short time, a method for forming a conduction part, and a copper-silver alloy and a conduction part. The present invention is provided with an ink preparation step for preparing a copper-silver ink by mixing copper salt particles, an amine-based solvent, and silver salt particles, an application step for applying the copper-silver ink to a member to be coated, a nucleation step for generating copper crystal nuclei having a crystal grain size of 0.2 µm or less and/or silver crystal nuclei having a crystal grain size of 0.2 µm or less from the copper-silver ink, and a crystal nucleus synthesis step for synthesizing the copper crystal nuclei and the silver crystal nuclei.
(FR) L'invention concerne un procédé destiné à la synthèse d'un alliage de cuivre-argent, un alliage de cuivre-argent pouvant facilement être synthétisé à basse température et en peu de temps, un procédé destiné à la formation d'une partie conductrice, et un alliage de cuivre-argent et une partie conductrice. La présente invention comprend une étape de préparation d'encre destinée à préparer une encre de cuivre-argent par mélange de particules de sel de cuivre, d'un solvant à base d'amine et de particules de sel d'argent, une étape d'application destinée à appliquer l'encre de cuivre-argent sur un élément à revêtir, une étape de nucléation destinée à générer des noyaux de cristaux de cuivre possédant une taille de grain cristallin inférieure ou égale à 0,2 µm et/ou des noyaux de cristaux d'argent possédant une taille de grain cristallin inférieure ou égale à 0,2 µm à partir de l'encre de cuivre-argent et une étape de synthèse de noyaux cristallins destinée à synthétiser les noyaux de cristaux de cuivre et les noyaux de cristaux d'argent.
(JA) 低温かつ短時間で簡易に銅銀合金を合成することができる銅銀合金の合成方法、および導通部の形成方法、並びに銅銀合金、および導通部を提供する。本発明は、銅塩粒子、アミン系溶剤、および銀塩粒子を混合して銅銀インクを調製するインク調製工程と、銅銀インクを被塗布部材に塗布する塗布工程と、銅銀インクから、結晶粒径が0.2μm以下の銅の結晶核及び結晶粒径が0.2μm以下の銀の結晶核の少なくとも一方を生成させる結晶核生成工程と、銅の結晶核および前記銀の結晶核を合成する結晶核合成工程と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)