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1. (WO2019017487) COMPOSITE RESIN MATERIAL AND MOLDED ARTICLE
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Pub. No.: WO/2019/017487 International Application No.: PCT/JP2018/027356
Publication Date: 24.01.2019 International Filing Date: 20.07.2018
IPC:
C08L 27/18 (2006.01) ,C08F 214/26 (2006.01) ,C08J 5/00 (2006.01) ,C08K 3/04 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
18
Homopolymers or copolymers of tetrafluoroethene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
214
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
18
Monomers containing fluorine
26
Tetrafluoroethene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
02
Elements
04
Carbon
Applicants:
東邦化成株式会社 TOHO KASEI CO., LTD. [JP/JP]; 奈良県大和郡山市今国府町6番2号 6-2, Imago-cho, Yamatokoriyama-shi, Nara 6391031, JP
大陽日酸株式会社 TAIYO NIPPON SANSO CORPORATION [JP/JP]; 東京都品川区小山一丁目3番26号 3-26, Koyama 1-chome, Shinagawa-ku, Tokyo 1428558, JP
Inventors:
山本 弘和 YAMAMOTO, Hirokazu; JP
中川 喬文 NAKAGAWA, Takafumi; JP
伊丹 宏貴 ITAMI, Hirotaka; JP
野口 勇 NOGUCHI, Isamu; JP
高田 克則 TAKADA, Katsunori; JP
幸田 祥人 KODA, Yasuhito; JP
坂井 徹 SAKAI, Toru; JP
Agent:
山尾 憲人 YAMAO, Norihito; JP
森住 憲一 MORIZUMI, Ken-Ichi; JP
Priority Data:
2017-14226221.07.2017JP
Title (EN) COMPOSITE RESIN MATERIAL AND MOLDED ARTICLE
(FR) MATÉRIAU DE RÉSINE COMPOSITE ET ARTICLE MOULÉ
(JA) 複合樹脂材料および成形体
Abstract:
(EN) The present invention addresses the problem of providing a resin material with which it is possible to achieve a resin molded article having low volume resistivity, and excellent weldability and cleanliness, as well as being less likely to exhibit increased volume resistivity when subjected to SPM cleaning and other treatments. The present invention provides a composite resin material including modified polytetrafluoroethylene, and carbon nanotubes, and having an average particle size of 500 μm or less.
(FR) La présente invention aborde le problème de la fourniture d’un matériau de résine avec lequel il est possible d’obtenir un article moulé en résine ayant une faible résistivité volumique, et une excellente aptitude au soudage et une excellente propreté, et qui est en outre moins susceptible de présenter une résistivité volumique accrue lorsqu’il est soumis à un nettoyage par SPM et d’autres traitements. La présente invention concerne un matériau de résine composite comprenant du polytétrafluoroéthylène modifié, et des nanotubes de carbone, et ayant une taille de particule moyenne de 500 µm ou moins.
(JA) 本発明は、低い体積抵抗率を有し、溶接性およびクリーン性に優れると共に、SPM洗浄処理等を行っても体積抵抗率が増加しにくい樹脂成形体を与える樹脂材料を提供することを課題とする。本発明は、変性ポリテトラフルオロエチレンおよびカーボンナノチューブを含み、500μm以下の平均粒子径を有する、複合樹脂材料を提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)