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1. (WO2019009259) COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
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Pub. No.: WO/2019/009259 International Application No.: PCT/JP2018/025103
Publication Date: 10.01.2019 International Filing Date: 02.07.2018
IPC:
C08L 79/08 (2006.01) ,C08K 5/00 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
日産化学株式会社 NISSAN CHEMICAL CORPORATION [JP/JP]; 東京都中央区日本橋二丁目5番1号 5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo 1036119, JP
Inventors:
奚 偉恩 HSI, Wayne; TW
何 邦慶 HO, Bang-ching; TW
Agent:
特許業務法人はなぶさ特許商標事務所 HANABUSA PATENT & TRADEMARK OFFICE; 東京都千代田区神田駿河台3丁目2番地 新御茶ノ水アーバントリニティ Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku, Tokyo 1010062, JP
Priority Data:
2017-13041903.07.2017JP
Title (EN) COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
(FR) COMPOSITION PERMETTANT DE FORMER UN SUBSTRAT DE DISPOSITIF FLEXIBLE
(JA) フレキシブルデバイス基板形成用組成物
Abstract:
(EN) [Problem] The purpose of the present invention is to provide a composition for forming a flexible device substrate, which enables the achievement of a resin thin film that has excellent properties as a base film for a flexible device substrate such as a flexible display substrate, said resin thin film maintaining excellent properties such as excellent heat resistance, low retardation, excellent flexibility and excellent transparency, while being able to be easily separated from a base material by means of a mechanical separation method (an MD method). [Solution] A composition for forming a flexible device substrate, which contains: a polyimide that is obtained using a tetracarboxylic acid dianhydride component that contains alicyclic tetracarboxylic acid dianhydrides represented by formula (C1) and formula (D1) and a diamine component that contains a fluorene diamine represented by formula (E1); and an organic solvent. (In the formulae, B1 represents a tetravalent group selected from the group consisting of groups represented by formulae (X-1) to (X-11).)
(FR) [Problème] L'objet de la présente invention est de fournir une composition permettant de former un substrat de dispositif flexible, qui permet d'obtenir une couche mince de résine qui présente d'excellentes propriétés comme couche de base pour un substrat de dispositif flexible tel qu'un substrat d'écran flexible, ladite couche mince de résine conservant d'excellentes propriétés telles qu'une excellente résistance à la chaleur, un faible retard, une excellente flexibilité et une excellente transparence, tout en pouvant être facilement séparée d'un matériau de base au moyen d'un procédé de séparation mécanique (procédé MD). [Solution] Une composition permettant de former un substrat de dispositif flexible, qui contient : un polyimide qui est obtenu en faisant appel à un constituant dianhydride d'acide tétracarboxylique qui contient des dianhydrides d'acide tétracarboxylique alicycliques représentés par la formule (C1) et la formule (D1) et un constituant diamine qui contient une diamine de fluorène représentée par la formule (E1); et un solvant organique. (Dans les formules, B1 représente un groupe tétravalent choisi dans le groupe constitué par les groupes représentés par les formules (X-1) à (X-11)).
(JA) 【課題】耐熱性に優れ、リタデーションが低く、柔軟性に優れ、さらに透明性にも優れるという優れた性能を維持すると共に、機械的剥離法(MD法)により基材から容易に剥離し得る、フレキシブルディスプレイ基板等のフレキシブルデバイス基板のベースフィルムとして優れた性能を有する樹脂薄膜を与えるフレキシブルデバイス基板形成用組成物を提供することを目的とする。 【解決手段】下記式(C1)及び下記式(D1)で表される脂環式テトラカルボン酸二無水物を含むテトラカルボン酸二無水物成分と、下記式(E1)で表されるフルオレンジアミンを含むジアミン成分とを用いて得られるポリイミドと有機溶媒とを含むフレキシブルデバイス基板形成用組成物。 〔式中、Bは、下記式(X-1)~(X-11)からなる群から選ばれる4価の基を表す。〕
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)