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1. (WO2019009066) RFID INLAY AND RFID LABEL
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Pub. No.: WO/2019/009066 International Application No.: PCT/JP2018/023389
Publication Date: 10.01.2019 International Filing Date: 20.06.2018
IPC:
G06K 19/077 (2006.01) ,G09F 3/00 (2006.01) ,H01Q 1/38 (2006.01) ,H01Q 7/00 (2006.01) ,H01Q 19/02 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
3
Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
7
Loop aerials with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
19
Combinations of primary active aerial elements and units with secondary devices, e.g. with quasi-optical devices, for giving the aerial a desired directional characteristic
02
Details
Applicants:
サトーホールディングス株式会社 SATO HOLDINGS KABUSHIKI KAISHA [JP/JP]; 東京都目黒区下目黒1丁目7番1号 7-1, Shimomeguro 1-chome, Meguro-ku, Tokyo 1530064, JP
Inventors:
新田 真也 NITTA, Shinya; JP
ファイズ アディ エザルディン ビン アディブ Faiz Adi Ezarudin Bin Adib; JP
Agent:
グローバル・アイピー東京特許業務法人 GLOBAL IP TOKYO; 東京都新宿区西新宿8丁目3番30号 カーメルII CARMEL II, 8-3-30, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023, JP
Priority Data:
2017-13351007.07.2017JP
Title (EN) RFID INLAY AND RFID LABEL
(FR) INCRUSTATION RFID ET ÉTIQUETTE RFID
(JA) RFIDインレイ、および、RFIDラベル
Abstract:
(EN) The RFID inlay according to one embodiment of the present invention is provided with: an IC chip; a first conductive film that constitutes a loop antenna electrically connected to the IC chip; and a second conductive film that constitutes a booster antenna separated from the first conductive film. The second conductive film has at least one hole.
(FR) Selon un mode de réalisation, la présente invention concerne une incrustation RFID pourvue : d'une puce de CI ; d'un premier film conducteur qui constitue une antenne cadre connectée électriquement à la puce de CI ; et d'un second film conducteur qui constitue une antenne d'amplification séparée du premier film conducteur. Le second film conducteur comporte au moins un trou.
(JA) 本発明のある態様に係るRFIDインレイは、ICチップと、ICチップに電気的に接続されたループアンテナを構成する第1導電膜と、第1導電膜から離間したブースタアンテナを構成する第2導電膜と、を備え、第2導電膜は、少なくとも1つの孔を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)