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1. (WO2019009063) PHOTOSHAPING COMPOSITION
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Pub. No.: WO/2019/009063 International Application No.: PCT/JP2018/023293
Publication Date: 10.01.2019 International Filing Date: 19.06.2018
IPC:
C08F 2/44 (2006.01) ,B29C 64/106 (2017.01) ,B29C 64/124 (2017.01) ,B33Y 70/00 (2015.01) ,C08K 3/34 (2006.01) ,C08L 33/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2
Processes of polymerisation
44
Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
[IPC code unknown for B29C 64/106][IPC code unknown for B29C 64/124][IPC code unknown for B33Y 70]
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
Applicants:
株式会社エンプラス ENPLAS CORPORATION [JP/JP]; 埼玉県川口市並木2丁目30番1号 30-1, Namiki 2-chome, Kawaguchi-shi, Saitama 3320034, JP
Inventors:
上本 紘平 JOHMOTO, Kohei; JP
石田 毅一郎 ISHIDA, Kiichiro; JP
小橋 一輝 KOBASHI, Itsuki; JP
Agent:
特許業務法人大貫小竹国際特許事務所 OHNUKI & KOTAKE; 東京都千代田区神田須田町二丁目25番地 山崎須田町ビル5階 Yamasakisudacho-Building 5th floor, 25, Kandasudacho 2-chome, Chiyoda-ku, Tokyo 1010041, JP
Priority Data:
2017-13210105.07.2017JP
2018-09198611.05.2018JP
Title (EN) PHOTOSHAPING COMPOSITION
(FR) COMPOSITION DE PHOTOFORMAGE
(JA) 光造形用組成物
Abstract:
(EN) [Problem] To provide a photoshaping composition which can give a shaped object having heightened mechanical properties in high-temperature environments and which can have a sufficiently low viscosity during shaping. [Solution] A photoshaping composition which comprises a photocurable resin and a phyllosilicate compound. It is preferred that the phyllosilicate compound is selected from the group consisting of mica, talc, silica, and mixtures of two or more of these. The photoshaping composition can give a shaped object which, in a high-temperature environment, has a storage modulus of 2,400 MPa or greater. During shaping, the photoshaping composition can have a viscosity less than 1,800 mPa∙s.
(FR) L'invention a pour objet une composition de photoformage qui permet d'obtenir un objet mis en forme ayant des propriétés mécaniques accrues dans des environnements à haute température et qui peut avoir une viscosité suffisamment faible pendant le formage. À et effet l'invention porte sur une composition de photoformage qui comprend une résine photodurcissable et un composé phyllosilicate. Il est préférable que le composé phyllosilicate soit choisi dans le groupe constitué par le mica, le talc, la silice et les mélanges de deux ou plus de deux de ceux-ci. La composition de photoformage permet d'obtenir un objet mis en forme qui, dans un environnement à haute température, a un module de conservation supérieur ou égal à 2 400 MPa. Pendant le formage, la composition de photoformage peut avoir une viscosité inférieure à 1800 mPa∙s.
(JA) 【課題】造形物において高温環境下での機械的物性を高くでき、且つ、造形時においては、粘度を十分に低くすることが可能な光造形用組成物を提供する。 【解決手段】光造形用組成物は、光硬化性樹脂と、層状ケイ酸塩化合物と、を含む。層状ケイ酸塩化合物としては、マイカ、タルク、シリカ、及び、これらを組み合わせた混合物からなる群から選択するとよい。造形物の高温環境下において、貯蔵弾性率を2400MPa以上とすることができ、また、造形時において、粘度を1800mPa・s未満とすることが可能となる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)