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1. (WO2019009062) HIGH FREQUENCY POWER CIRCUIT MODULE
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Pub. No.: WO/2019/009062 International Application No.: PCT/JP2018/023277
Publication Date: 10.01.2019 International Filing Date: 19.06.2018
IPC:
H05K 7/20 (2006.01) ,H01L 23/29 (2006.01) ,H01L 25/065 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01) ,H01Q 7/00 (2006.01) ,H01Q 23/00 (2006.01) ,H02J 7/00 (2006.01) ,H02J 50/10 (2016.01) ,H05K 1/02 (2006.01) ,H05K 3/28 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
7
Loop aerials with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
23
Aerials with active circuits or circuit elements integrated within them or attached to them
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
J
CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
7
Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
[IPC code unknown for H02J 50/10]
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
細谷 達也 HOSOTANI Tatsuya; JP
Agent:
特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE; 大阪府大阪市中央区農人橋1丁目4番34号 1-4-34, Noninbashi, Chuo-ku, Osaka-shi, Osaka 5400011, JP
Priority Data:
2017-13339207.07.2017JP
Title (EN) HIGH FREQUENCY POWER CIRCUIT MODULE
(FR) MODULE DE CIRCUIT DE PUISSANCE HAUTE FRÉQUENCE
(JA) 高周波電力回路モジュール
Abstract:
(EN) This high frequency power circuit module (101) is provided with: an electronic circuit board (1) having a bent portion; a high frequency power circuit formed on the electronic circuit board (1); a battery (3) connected to the high frequency power circuit; and a magnetic body sheet (4) having an area larger than that of the battery (3). The battery (3) is covered with the magnetic body sheet (4) in a state in which the bent portion (BS) of the electronic circuit board (1) is bent. The high frequency power circuit, the battery (3), and the magnetic body sheet (4) are thermally coupled to each other by means of a resin sealing body (5) which is a material having thermal resistance lower than that of air.
(FR) La présente invention concerne un module de circuit de puissance haute fréquence (101) comprenant : une carte de circuit électronique (1) présentant une partie courbée ; un circuit de puissance haute fréquence formé sur la carte de circuit électronique (1) ; une batterie (3) connectée au circuit d'alimentation haute fréquence ; et une feuille de corps magnétique (4) dont une surface est plus grande que celle de la batterie (3). La batterie (3) est recouverte par la feuille de corps magnétique (4) dans un état où la partie courbée (BS) de la carte de circuit électronique (1) est courbée. Le circuit de puissance haute fréquence, la batterie (3) et la feuille de corps magnétique (4) sont accouplés thermiquement les uns aux autres au moyen d'un corps d'étanchéité en résine (5) qui est un matériau dont la résistance thermique est inférieure à celle de l'air.
(JA) 高周波電力回路モジュール(101)は、屈曲部を有する電子回路基板(1)と、電子回路基板(1)に形成された高周波電力回路と、高周波電力回路に接続される電池(3)と、電池(3)よりも面積が大きい磁性体シート(4)と、を備える。電子回路基板(1)が屈曲部(BS)で屈曲された状態で、電池(3)は磁性体シート(4)で覆われる。高周波電力回路、電池(3)および磁性体シート(4)は、空気よりも熱抵抗の小さな素材である樹脂封止体(5)で互いに熱的に結合する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)