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1. (WO2019009054) SUBSTRATE TREATMENT SYSTEM, SUBSTRATE CLEANING METHOD, AND STORAGE MEDIUM
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Pub. No.: WO/2019/009054 International Application No.: PCT/JP2018/023178
Publication Date: 10.01.2019 International Filing Date: 19.06.2018
IPC:
H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
菅野 至 KANNO, Itaru; JP
関口 賢治 SEKIGUCHI, Kenji; JP
相原 明徳 AIBARA, Meitoku; JP
緒方 信博 OGATA, Nobuhiro; JP
Agent:
特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE; 東京都千代田区霞が関3丁目8番1号 虎の門三井ビルディング Toranomon Mitsui Building, 8-1, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1000013, JP
Priority Data:
2017-13048303.07.2017JP
Title (EN) SUBSTRATE TREATMENT SYSTEM, SUBSTRATE CLEANING METHOD, AND STORAGE MEDIUM
(FR) SYSTÈME DE TRAITEMENT DE SUBSTRAT, PROCÉDÉ DE NETTOYAGE DE SUBSTRAT, ET SUPPORT DE STOCKAGE
(JA) 基板処理システム、基板洗浄方法および記憶媒体
Abstract:
(EN) The substrate treatment system according to an embodiment of the present invention is provided with a holding unit, a peeling solution supply unit, and a dissolving solution supply unit. The holding unit holds a substrate, on which a treatment film containing a phenol resin is formed, said phenol resin being soluble in organic solvents. The peeling solution supply unit supplies the treatment film with a peeling solution that peels the treatment film from the substrate. The dissolving solution supply unit supplies the treatment film with a dissolving solution that dissolves the treatment film.
(FR) Un système de traitement de substrat selon un mode de réalisation de la présente invention comporte une unité de maintien, une unité d'alimentation en solution de pelage et une unité d'alimentation en solution de dissolution. L'unité de maintien maintient un substrat, sur lequel est formé un film de traitement contenant une résine phénolique, ladite résine phénolique étant soluble dans des solvants organiques. L'unité d'alimentation en solution de pelage fournit le film de traitement à une solution de pelage qui détache le film de traitement du substrat. L'unité d'alimentation en solution de dissolution fournit le film de traitement avec une solution de dissolution qui dissout le film de traitement.
(JA) 実施形態に係る基板処理システムは、保持部と、剥離処理液供給部と、溶解処理液供給部とを備える。保持部は、有機溶媒に可溶なフェノール樹脂を含有する処理膜が形成された基板を保持する。剥離処理液供給部は、処理膜を基板から剥離させる剥離処理液を処理膜に対して供給する。溶解処理液供給部は、処理膜を溶解させる溶解処理液を処理膜に対して供給する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)