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1. (WO2019008898) RESIN FILM FORMING FILM AND RESIN FILM FORMING COMPOSITE SHEET
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Pub. No.: WO/2019/008898 International Application No.: PCT/JP2018/018248
Publication Date: 10.01.2019 International Filing Date: 11.05.2018
IPC:
B32B 27/00 (2006.01) ,H01L 21/301 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
布施 啓示 FUSE Keishi; JP
Agent:
西澤 和純 NISHIZAWA Kazuyoshi; JP
五十嵐 光永 IGARASHI Koei; JP
加藤 広之 KATO Hiroyuki; JP
Priority Data:
2017-13298006.07.2017JP
Title (EN) RESIN FILM FORMING FILM AND RESIN FILM FORMING COMPOSITE SHEET
(FR) FILM FORMANT UN FILM DE RÉSINE ET FEUILLE COMPOSITE FORMANT UN FILM DE RÉSINE
(JA) 樹脂膜形成用フィルム及び樹脂膜形成用複合シート
Abstract:
(EN) This resin film forming film satisfies the following conditions (i) and (ii): (i) when a first test specimen manufactured using a first laminated body which comprises a plurality of the resin film forming films laminated together and has a size of 50 mm × 50 mm and a thickness of 200 μm is immersed in pure water for two hours, the first test specimen has a water absorption of 0.55% or less; and (ii) when a second test specimen manufactured using a second laminated body in which the resin film forming film is attached to a silicon mirror wafer has been left in an environment of 23°C and 50% RH for 30 minutes, and when the second test specimen after the elapse of the time has been immersed in pure water for two hours, an adhesive force between the resin film forming films or a cured product thereof and the silicon mirror wafer measured before and after the immersion exhibits an adhesive force change rate of 60% or less.
(FR) L'invention concerne un film formant un film de résine qui remplit les conditions suivantes (i) et (ii) : (i) lorsqu'un premier spécimen d'essai fabriqué au moyen d'un premier corps stratifié qui comprend une pluralité de films formant un film de résine stratifiés ensemble et présente une taille de 50 mm x 50 mm et une épaisseur de 200 µm est immergé dans de l'eau pure pendant deux heures, le premier spécimen d'essai présente une absorption d'eau de 0,55 % ou moins ; et (ii) lorsqu'un second spécimen d'essai fabriqué au moyen d'un second corps stratifié dans lequel le film formant un film de résine est fixé à une tranche miroir de silicium a été laissé dans un environnement de 23 °C et 50 % de RH pendant 30 minutes, et lorsque le second spécimen d'essai après l'écoulement du temps a été immergé dans de l'eau pure pendant deux heures, une force d'adhérence entre les films formant un film de résine ou un produit durci de ceux-ci et la tranche miroir de silicium mesurée avant et après l'immersion présente un taux de changement de force d'adhérence de 60 % ou moins.
(JA) この樹脂膜形成用フィルムは、以下の条件(i)及び(ii)を満たす。 (i)複数枚の前記樹脂膜形成用フィルムが積層されてなる、大きさが50mm×50mm、厚さが200μmの第1積層体を用いて作製した第1試験片を、純水中に2時間浸漬したとき、前記第1試験片の吸水率が0.55%以下となる。 (ii)前記樹脂膜形成用フィルムがシリコンミラーウエハに貼付されてなる第2積層体を用いて作製した第2試験片を、23℃、50%RHの環境下で30分経時させたときと、この経時後の第2試験片を純水中に2時間浸漬したときと、の浸漬前後において、樹脂膜形成用フィルム又はその硬化物と、シリコンミラーウエハと、の間の粘着力を測定したとき、粘着力変化率が60%以下となる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)