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1. (WO2019008876) METHOD FOR MANUFACTURING LAMINATED BODY, LAMINATED BODY, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD
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Pub. No.: WO/2019/008876 International Application No.: PCT/JP2018/016666
Publication Date: 10.01.2019 International Filing Date: 24.04.2018
IPC:
B32B 27/30 (2006.01) ,B32B 15/08 (2006.01) ,B32B 15/082 (2006.01) ,B32B 27/00 (2006.01) ,B32B 37/14 (2006.01) ,H05K 1/03 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
30
comprising vinyl resin; comprising acrylic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
082
comprising vinyl resins; comprising acrylic resins
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
14
characterised by the properties of the layers
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
AGC株式会社 AGC INC. [JP/JP]; 東京都千代田区丸の内一丁目5番1号 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008405, JP
Inventors:
笠井 渉 KASAI Wataru; JP
小寺 省吾 KOTERA Seigo; JP
Agent:
泉名 謙治 SENMYO Kenji; JP
小川 利春 OGAWA Toshiharu; JP
金 鎭文 KIM Jin-Moon; JP
比企野 健 HIKINO Ken; JP
横井 大一郎 YOKOI Daiichiro; JP
Priority Data:
2017-13388307.07.2017JP
2017-19309402.10.2017JP
Title (EN) METHOD FOR MANUFACTURING LAMINATED BODY, LAMINATED BODY, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD
(FR) PROCÉDÉ DE FABRICATION DE CORPS STRATIFIÉ, CORPS STRATIFIÉ ET PROCÉDÉ DE FABRICATION DE CARTE IMPRIMÉE FLEXIBLE
(JA) 積層体の製造方法、積層体及びフレキシブルプリント基板の製造方法
Abstract:
(EN) Provided are a laminated body in which wrinkles and interlayer separation are suppressed, a method for manufacturing the same, and a method for manufacturing a flexible printed board in which occurrence of wrinkles and interlayer separation is suppressed. A method for manufacturing a laminated body comprises: arranging, on one side or both sides of a first base material made of one or both of a heat resistance base material layer and a metal foil layer, a second base material having a first surface containing fluorine resin and having a wetting tension of 30 to 60 mN/m and a second surface having a wetting tension smaller than the wetting tension of the first surface by 2 mN/m or more, with the first surface directed toward the first base material side; and laminating the first base material and the second base material together by compressing the same in a thickness direction at a temperature T1 of 0 to 100°C while transporting the same, to obtain a laminated body I in which the first base material and the second base material are directly laminated together.
(FR) L'invention concerne un corps stratifié dans lequel les plis et la séparation entre les couches sont supprimés, un procédé de fabrication de celui-ci, et un procédé de fabrication d'une carte imprimée flexible dans lequel l'apparition des plis et la séparation entre les couches sont supprimées. Le procédé de fabrication d'un corps stratifié consistant: à agencer, sur un côté ou sur les deux côtés d'un premier matériau de base constitué d'une couche de matériau de base de résistance à la chaleur et/ou d'une couche de feuille métallique, un second matériau de base ayant une première surface contenant une résine fluorée et ayant une tension de mouillage de 30 à 60 mN/m et une seconde surface ayant une tension de mouillage inférieure à la tension de mouillage de la première surface par au moins 2 mN/m, la première surface étant dirigée vers le côté du premier matériau de base; et à stratifier le premier matériau de base et le second matériau de base ensemble par compression de ceux-ci dans une direction d'épaisseur à une température T1 de 0 à 100 °C tout en transportant ceux-ci, pour obtenir un corps stratifié I dans lequel le premier matériau de base et le second matériau de base sont directement stratifiés ensemble.
(JA) シワ及び層間剥離が抑制された積層体、その製造方法、及びシワ及び層間剥離の発生が抑制されたフレキシブルプリント基板の製造方法の提供。 耐熱性基材層及び金属箔層の何れか一方又は両方からなる第1基材の片側又は両側に、フッ素樹脂を含み、濡れ張力が30~60mN/mである第1面と、濡れ張力が第1面の濡れ張力よりも2mN/m以上小さい第2面とを有する第2基材を、前記第1面を前記第1基材側に向けて配置し、前記第1基材及び前記第2基材を搬送しながら、0~100℃の温度Tで厚み方向に加圧して積層し、前記第1基材と前記第2基材とが直接積層された積層体Iを得る、積層体の製造方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)