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1. (WO2019008803) WINDING SPOOL, BONDING WIRE WOUND STRUCTURE AND SPOOL CASE FOR WINDING SPOOL
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Pub. No.: WO/2019/008803 International Application No.: PCT/JP2018/002398
Publication Date: 10.01.2019 International Filing Date: 26.01.2018
IPC:
H01L 21/60 (2006.01) ,B65H 75/14 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
H
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
75
Storing webs, tapes, or filamentary material, e.g. on reels
02
Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans
04
Kinds or types
08
of circular or polygonal cross-section
14
with two end flanges
Applicants:
田中電子工業株式会社 TANAKA DENSHI KOGYO K.K. [JP/JP]; 佐賀県神埼郡吉野ヶ里町吉田2303-15 2303-15 Yoshida, Yoshinogari-cho, Kanzaki-gun, Saga 8420031, JP
Inventors:
木村 信行 KIMURA Nobuyuki; JP
大津 幸弘 OTSU Sachihiro; JP
Agent:
宮崎 悟 MIYAZAKI Satoru; JP
Priority Data:
2017-13091004.07.2017JP
Title (EN) WINDING SPOOL, BONDING WIRE WOUND STRUCTURE AND SPOOL CASE FOR WINDING SPOOL
(FR) BOBINE D'ENROULEMENT, STRUCTURE ENROULÉE DE FIL DE LIAISON ET BOÎTIER DE BOBINE POUR BOBINE D'ENROULEMENT
(JA) 巻取スプール、ボンディングワイヤの巻回構造および巻取スプール用スプールケース
Abstract:
(EN) One objective of the present invention is to provide a winding spool for bonding wire and a spool case, which are free from winding collapse even when subject to a large impact during transit in cross-border, long-distance transportation. This winding spool for bonding wire is formed from synthetic resin and comprises a trunk section and flange sections, the trunk section having a guide hole coinciding with the central axis, and is characterized in that the elevation angle formed between the trunk section and each of the flange sections is between 77 degrees and 86 degrees (both inclusive) and, given that the bonding wire diameter is "1", the ratio of the trunk section winding width length to the bonding wire diameter is 50-550:1.
(FR) Un objectif de la présente invention est de fournir une bobine d'enroulement pour un fil de liaison et un boîtier de bobine, qui sont exempts d'affaissement d'enroulement même lorsqu'ils sont soumis à un impact important pendant le transfert d'un transport longue distance transfrontalier. Cette bobine d'enroulement pour fil de liaison est constituée de résine synthétique et comprend une section de tronc et des sections de bride, la section de tronc ayant un trou de guidage coïncidant avec l'axe central, et est caractérisée en ce que l'angle d'élévation formé entre la section de tronc et chacune des sections de bride est compris entre 77 degrés (inclus) et 86 degrés (inclus) et, dès lors que le diamètre du fil de liaison est égal à "1", le rapport entre la longueur de la largeur d'enroulement de la section de tronc et le diamètre du fil de liaison est de 50 à 550 : 1.
(JA) 本発明の目的は、国境を越えた長距離の輸送によっても移送中に大きな衝撃が加えられても巻崩れしないボンディングワイヤ用巻取スプールおよびスプールケースを提供することにある。本発明の巻取スプールは、中心軸にガイド穴を有する胴部およびフランジ部からなる合成樹脂製のボンディングワイヤ用の巻取スプールにおいて、当該胴部と当該フランジ部の仰角が77度以上86度以下であり、かつ、当該ボンディングワイヤの直径を1とした場合に対する当該胴部の巻幅長さの割合が50以上550以下であることを特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)