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1. (WO2019007322) STACKED SPIRAL INDUCTOR
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Pub. No.: WO/2019/007322 International Application No.: PCT/CN2018/094241
Publication Date: 10.01.2019 International Filing Date: 03.07.2018
IPC:
H01L 23/12 (2006.01) ,H01F 17/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17
Fixed inductances of the signal type
Applicants:
无锡华润上华科技有限公司 CSMC TECHNOLOGIES FAB2 CO., LTD. [CN/CN]; 中国江苏省无锡市 新区新洲路8号 No.8 Xinzhou Road Wuxi New District, Jiangsu 214028, CN
Inventors:
董聪颖 DONG, Congying; CN
Agent:
广州华进联合专利商标代理有限公司 ADVANCE CHINA IP LAW OFFICE; 中国广东省广州市 天河区花城大道85号3901房 Room 3901, No.85 Huacheng Avenue, Tianhe District Guangzhou, Guangdong 510623, CN
Priority Data:
201710534700.203.07.2017CN
Title (EN) STACKED SPIRAL INDUCTOR
(FR) BOBINE D'INDUCTANCE À SPIRES EMPILÉES
(ZH) 堆叠螺旋电感
Abstract:
(EN) A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a through hole area having a spiral conductive coil and used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.
(FR) L'invention concerne une bobine d'inductance à spires empilées comprenant : un substrat et de multiples couches isolantes et des couches métalliques inductives empilées formées sur le substrat au moyen d'un traitement de semi-conducteurs. Chaque couche métallique inductive comprend une zone de trou traversant comportant une bobine conductrice à spires et est utilisée pour connecter deux couches métalliques inductives adjacentes. Les bobines conductrices des couches métalliques inductives ont un centre de bobine commun. Dans deux couches métalliques inductives adjacentes, la bobine conductrice de la couche métallique inductive inférieure est en retrait vers le centre de la bobine par rapport à la bobine conductrice de la couche métallique inductive supérieure.
(ZH) 一种堆叠螺旋电感,包括衬底以及通过半导体工艺在衬底上形成多层堆叠的绝缘层和电感金属层;电感金属层包括具有螺旋状的导电线圈以及用于连接相邻两层电感金属层的通孔区域,各个电感金属层的导线线圈具有公共的线圈中心,相邻两层电感金属层中,下层电感金属层的导电线圈相对于上层电感金属层的导电线圈向线圈中心缩进。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)