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1. (WO2019006238) OPTICAL TRANSCEIVER HAVING HEAT DISSIPATION
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Pub. No.: WO/2019/006238 International Application No.: PCT/US2018/040184
Publication Date: 03.01.2019 International Filing Date: 29.06.2018
IPC:
F21V 8/00 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
8
Use of light guides, e.g. fibre optic devices, in lighting devices or systems
Applicants:
SAMTEC INC. [US/US]; 520 Park East Boulevard New Albany, Indiana 47150, US
Inventors:
BETTMAN, R., Brad; US
LANGSAM, David; US
SHAH, Jignesh; US
Agent:
FORMAN, Adam, J.; US
Priority Data:
62/527,71130.06.2017US
62/614,62608.01.2018US
Title (EN) OPTICAL TRANSCEIVER HAVING HEAT DISSIPATION
(FR) ÉMETTEUR-RÉCEPTEUR OPTIQUE À DISSIPATION DE CHALEUR
Abstract:
(EN) An optical transceiver provides substantial thermal isolation between an IC die and an optical element that is in electrical communication with the IC die. The IC die is further in electrical communication with a substrate that supports the optical element and the IC die. The transceiver includes an IC heat spreader that is configured to dissipate heat generated from the IC die. The IC die and the optical element can be substantially thermally isolated from each other so as to prevent the heat generated from the IC die from causing the optical elements to overheat.
(FR) Un émetteur-récepteur optique fournit une isolation thermique substantielle entre une puce de CI et un élément optique qui est en communication électrique avec la puce de CI. La puce de CI est en outre en communication électrique avec un substrat qui supporte l'élément optique et la puce de CI. L'émetteur-récepteur comprend un dissipateur thermique de CI qui est configuré pour dissiper la chaleur générée à partir de la puce de CI. La puce de CI et l'élément optique peuvent être sensiblement isolés thermiquement l'un de l'autre de façon à empêcher la chaleur générée par la puce de CI de provoquer la surchauffe des éléments optiques.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)