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1. (WO2019005621) SELF-CONFIGURING COMPONENT IDENTIFICATION AND SIGNAL PROCESSING SYSTEM FOR A COORDINATE MEASUREMENT MACHINE
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Pub. No.: WO/2019/005621 International Application No.: PCT/US2018/039077
Publication Date: 03.01.2019 International Filing Date: 22.06.2018
IPC:
G01B 5/004 (2006.01) ,G01B 21/04 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
02
for measuring length, width, or thickness
04
specially adapted for measuring length or width of objects while moving
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
02
for measuring length, width, or thickness
04
by measuring coordinates of points
Applicants:
MITUTOYO CORPORATION [JP/JP]; 20-1, Sakado 1-Chome, Takatsu-Ku Kawasaki-shi, Kanagawa-ken 213-8533, JP
Inventors:
HEMMINGS, Scott, Ellis; US
Agent:
LEEK, Shoko, I.; US
OBEIDAT, Baha, A.; US
KUMABE, Blake, K.; US
SOLTANI, Bobby, B.; US
ZENTZ, Bradley, J.; US
SARGEANT, Brooke; US
QUIST, Brooke, W.; US
O'BRIEN, Daniel; US
ROTH, Carol, J.; US
EIDT, Chandra, E.; US
STARK, Duncan; US
CARLSON, David, V.; US
TARLETON, E., Russell; US
SUN, Eileen, S.; US
HARWOOD, Eric, A.; US
ABRAMONTE, Frank; US
GERTZ, Glenda, A.; US
HAN, Hai; US
TALBERT, Hayley, J.; US
WHITE, James, A. D.; US
BARRETT, Jared, M.; US
PEPE, Jeffrey, C.; US
DANLEY, Jeffrey, E.; US
SAKOI, Jeffrey, M.; US
BAUNACH, Jeremiah, J.; US
KARLEN, John, R.; US
MORGAN, John, A.; US
WAKELEY, John, J.; US
COE, Justin, E.; US
HENCKEL, Karen, M.; US
HEFTER, Karl, A.; US
HERMANNS, Karl, R.; US
MORGAN, Kevan, L.; US
COSTANZA, Kevin, S.; US
LINFORD, Lorraine; US
COOPER, Michael, P.; US
RUSYN, Paul; US
LIN, Qing; US
HALLER, Rachel, A.; US
IANNUCCI, Robert; US
KOVELMAN, Robert, L.; US
WEBB, Samuel, E.; US
ROSENMAN, Stephen, J.; US
ABEDI, Syed; US
SHEWMAKE, Thomas, A.; US
SATAGAJ, Thomas, J.; US
BOLLER, Timothy, L.; US
LIGON, Toby, J.; US
CANTRELL, Tyler, C.; US
FERRON, William, O., Jr.; US
Priority Data:
62/527,76330.06.2017US
Title (EN) SELF-CONFIGURING COMPONENT IDENTIFICATION AND SIGNAL PROCESSING SYSTEM FOR A COORDINATE MEASUREMENT MACHINE
(FR) SYSTÈME D'IDENTIFICATION DE COMPOSANT À AUTO-CONFIGURATION ET DE TRAITEMENT DE SIGNAL POUR UNE MACHINE DE MESURE DE COORDONNÉES
Abstract:
(EN) A set of respective self-configuring probe interface circuit boards (SC-MPIC's) are disclosed for use with a measurement system comprising host electronics and respective interchangeable measurement probes. Member SC-MPICs each comprises: a local circuit (LS) for probe identification, signal processing and inter-board signal control; and higher-direction and lower-direction connectors "pointing" toward and away from the measurement probe, respectively. Member SC-MPICs establish a processing hierarchy by generating lower board present signals on their higher-direction connector, higher board present signals on their lower-direction connector, and determining whether they are the highest and/or lowest SC-MPIC based on receiving those signals from adjacent SC-MPICs. They can independently perform probe identification matching operations using probe identification data from compatible and incompatible probes, and the highest SC-MPIC does this first. Member SC-MPICs advantageously pass through or isolate signals from other members in the set depending on the hierarchy, various received signals, and internal processing.
(FR) L'invention concerne un ensemble de cartes de circuit d'interface de sonde à auto-configuration respectives (SC-MPIC) destinées à être utilisées avec un système de mesure comprenant une électronique hôte et des sondes de mesure interchangeables respectives. Les éléments SC-MPIC comprennent chacun : un circuit local (LS) pour l'identification de sonde,un circuit de traitement de signal et de commande de signal inter-carte ; et des connecteurs de direction supérieure et de direction inférieure "pointant" respectivement vers la sonde de mesure et à l'opposé de celle-ci. Des éléments SC-MPIC établissent une hiérarchie de traitement en générant des signaux de présence de carte inférieure sur leur connecteur de direction supérieure, de signaux de présence de carte supérieure sur leur connecteur de direction inférieure, et en déterminant s'ils sont le SC-MPIC le plus haut et/ou le plus bas sur la base de la réception de ces signaux provenant de SC-MPIC adjacents. Ils peuvent effectuer indépendamment des opérations de correspondance d'identification de sonde à l'aide de données d'identification de sonde de sondes compatibles et incompatibles, et le SC-MPIC le plus élevé l'effectue en premier. Les éléments SC-MPC passent avantageusement à travers ou isolent des signaux d'autres éléments de l'ensemble en fonction de la hiérarchie, de divers signaux reçus, et d'un traitement interne.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)