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1. (WO2019005542) IMAGE IMPROVEMENT FOR ALIGNMENT THROUGH INCOHERENT ILLUMINATION BLENDING
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Pub. No.: WO/2019/005542 International Application No.: PCT/US2018/038327
Publication Date: 03.01.2019 International Filing Date: 19.06.2018
IPC:
G03F 7/20 (2006.01) ,G03F 9/00 (2006.01) ,H01L 21/027 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9
Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
COSKUN, Tamer; US
JEONG, Hwan J.; US
Agent:
PATTERSON, B. Todd; US
VERSTEEG, Steven H.; US
Priority Data:
62/525,02126.06.2017US
Title (EN) IMAGE IMPROVEMENT FOR ALIGNMENT THROUGH INCOHERENT ILLUMINATION BLENDING
(FR) AMÉLIORATION D'IMAGE POUR L'ALIGNEMENT PAR MÉLANGE D'ÉCLAIRAGES INCOHÉRENTS
Abstract:
(EN) Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that includes opening a camera shutter in a maskless lithography system. Light is directed from a configuration of non-adjacent mirrors in a mirror array towards a first substrate layer. An image of the first substrate layer on a camera is captured and accumulated. Light is directed and images are captured repeatedly using different configurations of non-adjacent mirrors to cover an entire field-of-view (FOV) of the camera on the first substrate layer. Thereafter, the camera shutter is closed and the accumulated image is stored in memory.
(FR) L'invention concerne des procédés et des appareils qui déterminent un décalage entre des emplacements de caractéristiques/repères réels et les emplacements de caractéristiques/repères prédéfinis dans un système de lithographie sans masque. Par exemple, un mode de réalisation concerne un procédé qui comprend l'étape consistant à ouvrir l'obturateur d'une caméra dans un système de lithographie sans masque. Une lumière provenant d'une configuration de miroirs non adjacents d'un réseau de miroirs est dirigée sur une première couche de substrat. Une image de la première couche de substrat est capturée et accumulée sur une caméra. La lumière est dirigée et des images sont capturées de manière répétée à l'aide de différentes configurations de miroirs non adjacents afin de couvrir un champ de vision (FOV) complet de la caméra sur la première couche de substrat. L'obturateur de la caméra est ensuite refermé et l'image accumulée est enregistrée en mémoire.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)