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1. (WO2019005452) COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES
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Pub. No.: WO/2019/005452 International Application No.: PCT/US2018/036499
Publication Date: 03.01.2019 International Filing Date: 07.06.2018
IPC:
C03C 3/064 (2006.01) ,C03C 8/02 (2006.01) ,C03C 8/18 (2006.01) ,H01B 1/22 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
3
Glass compositions
04
containing silica
062
with less than 40% silica by weight
064
containing boron
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8
Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
02
Frit compositions, i.e. in a powdered or comminuted form
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8
Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
14
Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
18
containing free metals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
Applicants:
HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC [US/US]; 24 Union Hill Road West Conshohocken, Pennsylvania 19428, US
Inventors:
GARCIA, Virginia C.; US
PERSONS, Ryan; US
BERUBE, Gregory; US
SGRICCIA, Matthew; US
Agent:
WOLFE, Charles R., Jr.; US
Priority Data:
62/526,62329.06.2017US
Title (EN) COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES
(FR) PÂTES ÉLECTROCONDUCTRICES POUR IMPRESSION ÉPAISSE CONTENANT DU CUIVRE
Abstract:
(EN) The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.
(FR) L'invention concerne une pâte électroconductrice destinée à être utilisée dans la formation d'une électrode sur un substrat de nitrure de silicium qui comprend au moins deux types de particules de cuivre ayant chacune un diamètre moyen de particule différent (d50), une fritte de verre comprenant au moins de l'oxyde de bismuth, de l'oxyde de silicium et de l'oxyde de bore, au moins un additif favorisant l'adhérence comprenant de l'oxyde d'aluminium, de l'oxyde de cérium ou des combinaisons de ces derniers, et un véhicule organique. L'invention concerne également une pâte électroconductrice destinée à être utilisée dans la formation d'une électrode sur un substrat de nitrure d'aluminium, qui comprend au moins trois types de particules de cuivre ayant chacune un diamètre moyen de particule différent (d50), une fritte de verre comprenant au moins de l'oxyde de bismuth et de l'oxyde de silicium, et de l'oxyde de bore, au moins un additif favorisant l'adhérence comprenant de l'oxyde de bismuth, de l'oxyde de zinc, de l'oxyde de titane, de l'oxyde de cérium, ou des combinaisons de ces derniers, et un véhicule organique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)