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1. (WO2019005362) ADAPTIVE COOLING HEAT SPREADER
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Pub. No.: WO/2019/005362 International Application No.: PCT/US2018/034504
Publication Date: 03.01.2019 International Filing Date: 25.05.2018
IPC:
G06F 1/20 (2006.01) ,H05K 7/20 (2006.01) ,H01L 23/427 (2006.01) ,H01L 23/373 (2006.01) ,F28D 15/04 (2006.01) ,F28D 15/06 (2006.01) ,F28F 13/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
20
Cooling means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427
Cooling by change of state, e.g. use of heat pipes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
D
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15
Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02
in which the medium condenses and evaporates, e.g. heat-pipes
04
with tubes having a capillary structure
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
D
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15
Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02
in which the medium condenses and evaporates, e.g. heat-pipes
06
Control arrangements therefor
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
F
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13
Arrangements for modifying heat transfer, e.g. increasing, decreasing
Applicants:
MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; One Microsoft Way Redmond, Washington 98052-6399, US
Inventors:
HO, Chau Van; US
WHITT, David Otto, III; US
DELANO, Andrew Douglas; US
NAGENDRAN, Bharath; US
Agent:
MINHAS, Sandip S.; US
CHEN, Wei-Chen Nicholas; US
HINOJOSA, Brianna L.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
HWANG, William C.; US
WIGHT, Stephen A.; US
CHATTERJEE, Aaron C.; US
JARDINE, John S.; US
GOLDSMITH, Micah P.; US
Priority Data:
15/639,77330.06.2017US
Title (EN) ADAPTIVE COOLING HEAT SPREADER
(FR) DISSIPATEUR THERMIQUE À REFROIDISSEMENT ADAPTATIF
Abstract:
(EN) Computing devices, thermal management devices, and corresponding use methods are described herein. A computing device includes a housing, an electronic component supported by the housing, and a heat spreader physically connected to the electronic component. The heat spreader includes an adjustable part that is adjustable between a first state and a second state. Heat generated by the electronic component flows through the adjustable part when the adjustable part is in the first state, and the adjustable part is operable to redirect at least a portion of the heat when the adjustable part is in the second state.
(FR) L’invention concerne des dispositifs informatiques, des dispositifs de gestion thermique et des procédés d’utilisation correspondants. Un dispositif informatique comprend un boîtier, un composant électronique supporté par le boîtier, et un dissipateur thermique physiquement raccordé au composant électronique. Le dissipateur thermique comprend une partie réglable qui peut être réglée entre un premier état et un second état. La chaleur générée par le composant électronique s'écoule à travers la partie réglable lorsque la partie réglable est dans le premier état, et la partie réglable permet de rediriger au moins une partie de la chaleur lorsque la partie réglable est dans le second état.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)