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1. (WO2019005265) MODULAR HYBRID CIRCUIT PACKAGING
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/005265 International Application No.: PCT/US2018/027226
Publication Date: 03.01.2019 International Filing Date: 12.04.2018
IPC:
H01L 23/057 (2006.01) ,H01L 23/10 (2006.01) ,H01L 25/16 (2006.01) ,G01L 19/14 (2006.01) ,G01D 11/24 (2006.01) ,H05K 5/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
053
the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
057
the leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
10
characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14
Housings
G PHYSICS
01
MEASURING; TESTING
D
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; TRANSFERRING OR TRANSDUCING ARRANGEMENTS NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
11
Component parts of measuring arrangements not specially adapted for a specific variable
24
Housings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
Applicants:
ROSEMOUNT INC. [US/US]; 6021 Innovation Boulevard Shakopee, MN 55379, US
Inventors:
ANDREW, David Alexander; US
STREI, David Matthew; US
WALTERS, James, III; US
CUTTER, David; US
Agent:
CHAMPLIN, Judson K.; US
MAGEE, Theodore, M.; US
KAUL, Brian, D.; US
WESTMAN, Nickolas, E.; US
BRUSH, David, D.; US
Priority Data:
15/636,87029.06.2017US
Title (EN) MODULAR HYBRID CIRCUIT PACKAGING
(FR) MISE SOUS BOÎTIER DE CIRCUIT HYBRIDE MODULAIRE
Abstract:
(EN) An electronics package (100) includes a platform (102) and a board (104) mounted to the platform (102) the board (104) having electronics mounted thereon. A feedthrough pin (136- 148) passes through and is hermetically sealed to a feedthrough body (106) and is wire bonded to the board (104). A cover (110) is bonded to and surrounds the exterior surface of the feedthrough body (106) to produce a hermetically sealed chamber (111) that houses the platform (102) and the board (104).
(FR) Un boîtier électronique (100) comprend une plateforme (102) et une carte (104) montée sur la plateforme (102), la carte (104) ayant des composants électroniques montés sur celle-ci. Une broche (136-148) de traversée électrique traverse un corps (106) de traversée électrique, et est hermétiquement scellée à celui-ci, et est liée par un fil à la carte (104). Un couvercle (110) est lié à la surface extérieure du corps (106) de traversée électrique, et entoure celle-ci, pour produire une chambre hermétiquement scellée (111) qui loge la plateforme (102) et la carte (104).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)