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1. (WO2019005152) DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
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CLAIMS

What is claimed is:

1. A device package, comprising:

a foundation layer having one or more dies disposed on the foundation layer, wherein each die has a front side surface that is electrically coupled to the foundation layer and a back side surface that is opposite from the front side surface; and

a stiffening layer formed on the back side surface of at least one of the one or more dies.

2. The device package of claim 1, wherein the stiffening layer is directly coupled to the back side surface of the one or more dies without an adhesive layer.

3. The device package of claim 1, wherein the stiffening layer includes one or more materials, and wherein the one or more materials include at least one of a metal, a metal alloy, and a ceramic.

4. The device package of claim 1, further comprising a motherboard formed below the foundation layer, wherein the motherboard is electrically coupled to the foundation layer.

5. The device package of claim 1 , wherein the stiffening layer is formed to reduce warpage based on the foundation layer and the one or more dies.

6. The device package of claim 3, wherein the one or more materials of the stiffening layer are formed on the back side of the die using a cold spray process.

7. The device package of claim 1, wherein the stiffening layer is formed using one or more patterns.

8. The device package of claim 1, further comprising a gap between each of the one or more dies, and wherein the stiffening layer is formed directly on the one or more dies and not formed on the gap.

9. The device package of claim 1, further comprising an underfill layer formed between the one or more dies and the foundation layer.

10. The device package of claim 1, wherein the stiffening layer is formed on the die at a wafer level or a panel level.

11. The device package of claim 1, wherein the foundation layer is a printed circuit board.

12. A method of forming a device package, the method comprising:

disposing one or more dies on a foundation layer, wherein each die has a front side surface that is electrically coupled to the foundation layer and a back side surface that is opposite from the front side surface; and

depositing a stiffening layer on the back side surface of at least one of the one or more dies.

13. The method of claim 12, wherein the stiffening layer is directly coupled to the back side surface of the one or more dies without an adhesive layer.

14. The method of claim 12, wherein the stiffening layer includes one or more materials, and wherein the one or more materials include at least one of a metal, a metal alloy, and a ceramic.

15. The method of claim 12, further comprising forming a motherboard below the foundation layer, wherein the motherboard is electrically coupled to the foundation layer.

16. The method of claim 12, wherein the stiffening layer is formed to reduce warpage based on the foundation layer and the one or more dies.

17. The method of claim 14, wherein the one or more materials of the stiffening layer are formed on the back side of the die using a cold spray process.

18. The method of claim 12, wherein the stiffening layer is formed using one or more patterns.

19. The method of claim 12, further comprising a gap between each of the one or more dies, and wherein the stiffening layer is formed directly on the one or more dies and not formed on the gap.

20. The method of claim 12, further comprising forming an underfill layer between the one or more dies and the foundation layer.

21. The method of claim 12, wherein the stiffening layer is formed on the die at a wafer level or a panel level.

22. The method of claim 12, wherein the foundation layer is a printed circuit board.

23. A method of forming a die with a stiffening structure on a back side surface of the die, the method comprising:

forming one or more dies and one or more dicing streets on a wafer;

depositing a seed layer over the one or more dies and dicing streets formed on the wafer; depositing a photoresist layer over the seed layer and patterning the photoresist layer to form one or more stiffener openings over the one or more dies but not over the one or more dicing streets;

depositing a stiffening layer into the one or more stiffener openings to form one or more stiffeners on the back side surfaces of the one or more dies; and

removing the photoresist layer and the seed layer after the one or more stiffeners are formed on the back side surfaces of the one or more dies.

24. The method of claim 23, wherein the one or more stiffeners are directly coupled to the back side surfaces of the one or more dies without an adhesive layer, and wherein the stiffening layer includes one or more materials that include at least one of a metal, a metal alloy, and a ceramic.

25. The method of claim 23, wherein the one or more stiffeners are formed using one or more patterns.